Isola Featured in EDN Blog

PCB laminates influence high-speed data rates

As featured in EDN by Lee Ritchey, President, Speeding Edge

The Faster We Go, The More We Need to Know: The role that PCB laminates play in achieving high speed data rates.

Taking this somewhat ambiguous subtitle and putting some parameters and definers around it, the topic that this article addresses is the manner in which differential signaling has evolved into being the principal way in which electronic components are connected and some of the things that can degrade a signal path.  At this particular juncture in time, the entire Internet relies on differential signaling to move data from one place to another. Without this method of signaling, the Internet and the plethora of communication products upon which we have all come to rely would not be viable or, even more accurately, couldn’t exist.

The good news is that the latest versions of ICs make it possible to send data over differential pairs in PCBs at rates as high as 32Gb/S (and higher). The bad news or, perhaps more accurately, the gauntlet that has been thrown down to the industry is that at these speeds, very small variations in the laminates used to fabricate PCBs can destroy a data path if care is not taken in how these paths are designed and manufactured. And, one of the variations that destroys data links in a path is skew.

Starting with the basics of the problem, skew is the misalignment of the two signal edges of a differential pair as they arrive at the terminals of the differential receiver.  The outcome of skew is pretty straight forward. When the aforementioned misalignment is bad enough, the links in the data paths may no longer work.

At this point, it’s useful to define differential pairs and review how they operate:

  • A differential pair is a signal path that has two equal and opposite signals travelling on the two paths.
  • The receiver detects the “difference” voltage at its input and determines whether the data bit is a one or a zero.
  • The receiver is designed to ignore the “common mode” component of the signal, usually a voltage offset.  This is the primary benefit of this signaling protocol.
  • Figure 1 is a graphical representation of a differential pair.

Read the complete article online at EDN.com.

 

09 September 2015

Related Posts

Isola Extends Production Of FR408HR Materials To Its German Facility
Isola Extends Production of FR408HR
Isola Extends Production of FR408HR Materials to its German Facility Shortening lead times on FR408HR for European fabricators will accelerate the manufacturing cycle for advanced printed circuit boards CHANDLER, Ariz., 8, 2014, — Isola Group S.à r.l., a market leader in dielectric materials used to fabricate advanced multilayer printed circuit…
Embedded Computing Blog PCB Laminate Considerations For 4G Based M2M Designs
Embedded Computing Blog: Metal Clad Substrates
Isola’s Metal Clad Substrates Featured in Embedded Computing Blog Rich Nass, Brand Director at Embedded Computing discusses Metal Clad Substrates in this new blog post titled, “Thermal Management Techniques Extend Automotive ECU’s Reliability.” In the blog, he features Isola’s Lambda materials. Read the blog here.
Isola Issues Cease And Desist Notification Files For Injunction In ROC Against TUC
Isola Issues Cease and Desist Notification, Files for Injunction in R.O.C. Against TUC
CHANDLER, ARIZONA, September 16, 2008 – Isola USA Corporation (“Isola”), demanded that TUC respect the R.O.C. invention patent No. 123529 entitled “Fillers for Improved Epoxy Laminates” immediately cease all acts that would infringe on the patent, including but not limited to manufacturing the products with the Nos. TUC662 and TUC752…