Media Contact:

Isola 2016 Fact Sheet

DesignCon – January 29-30, 2013

 Isola exhibited in booth 819 at DesignCon in Santa Clara, CA on January 28-30, 2013. Created by engineers for engineers, DesignCon offers inspiration at its finest, featuring four days of intensive technical learning and networking and days of exhibits! The community relies on DesignCon to find out what the latest technologies and developments are in the industry. It is the largest meeting of board designers, and is the ONLY event to address chip design engineers' chip/system/package challenges.

Visitors to the Isola’s booth learned about the company’s newest products, including:

  • I-Tera®: Ultra low-loss laminate (Df 0.0035) for high-speed digital, backplane and RF/microwave designs
  • I-Speed®: Lead-free compatible, low-loss (Df 0.0065) laminate
  • 185HR: High reliability, lead-free compatible, standard loss product
  • FR408HR: High-performance, multifunctional resin system reinforced with E-glass fabric

Lee Ritchey, founder and president of Speeding Edge, presented a technical paper entitled, “High-Speed Signal Path Losses as Related to PCB Laminate Type and Copper Roughness Effect” in Ballroom E on Tuesday, January 29, 2013 from 2:00 PM - 2:40 PM. The presentation discussed testing that was done on seven different laminate systems used to build test PCBs in order to determine how loss is impacted by the effect of using smooth vs. standard copper. In addition, the lowest cost method for controlling skew was determined and the loss tangent of several materials was established. The result provided engineers with information to reliably model path loss. Mr. Ritchey worked with Isola to gather data for this paper.