Isola USA Sues TUC for Infringing Its Laminate Technology Patents

CHANDLER, Ariz., July 11, 2012 (GLOBE NEWSWIRE) — Isola Group S.a.r.l., a leading global material sciences company that designs, develops, manufactures and markets copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), today announced its U.S. subsidiary, Isola USA Corp., filed a patent infringement lawsuit against Taiwan Union Technology Corporation (TUC) in the United States District Court for the District of Arizona on June 26, 2012.

The lawsuit alleges infringement of United States Patent Nos. 6,509,414 (“Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Co-Crosslinking Agent”) and 7,897,258 (“Laminate Made from Epoxy Resin, Styrene-Maleic Anhydride Copolymer and Crosslinkers”) through TUC’s importing, selling and offering for sale its laminate and prepreg products in the United States, including the company’s TU-872 SLK product. These patents can provide enhanced thermal and electrical properties to the prepregs and laminates used to make PCBs. The complaint seeks money damages and a permanent injunction against TUC from making, using, importing, offering to sell and selling the accused products in the United States.

“Isola is a proven technology leader in the laminate industry and our intellectual property is a valuable asset,” said Raymond P. Sharpe, President and CEO of Isola Group. “We have a responsibility to our shareholders, customers and employees to vigorously protect our investments and our valuable patent portfolio. Filing this lawsuit is an essential step in protecting our patent rights.”

About Isola

Isola Group S.a.r.l., headquartered in Chandler, Arizona, is a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards. The company’s high-performance materials are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. For more information, visit

11 July 2012

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