No Low Flow Resin Systems For Adhesive Applications

No Low Flow Resin Systems For Adhesive Applications

23 February 2016

Related Posts

No Low Flow Resin Systems For Adhesive Applications
No/Low Flow Resin Systems for Adhesive Applications
Isola offers several proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.prepreg. A11 and FR406N are epoxy resin systems. A11 features a Tg of 100°C as is suitable for standard applications.
SMTA Ohio Valley Expo & Tech Forum
SMTA Ohio Valley Expo & Tech Forum – July 16, 2015
Isola will participate in the Ohio Valley Expo & Tech Forum on July 16, 2015. The event will be held at the Doubletree Hotel  6200 Quarry Lane in Independence, OH. The show hours are from 10AM to 3PM. For more details, please visit http://smta.org/expos/#ohio.
Video Isola European Market Update With PCB007
Video: Isola European Market Update with PCB007
Isola Interviewed at productronica 2015 Helmut Kroener Discusses European PCB Market Peter Starkey of PCB 007 interviewed Isola’s Helmut Kroener at productronica 2015. Helmut discusses market trends and Isola’s support throughout Europe.