A11
No-Flo® Specialty Prepreg
The A11 family of no-flow prepregs consists of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
Thermal Performance |
Electrical Performance |
Industry Approvals |
Tg:
100°C
Td: 300°C |
Dk:
4.50
Df: 0.033 |
IPC-4101 /20
UL - File Number E41625
|
Thermal Performance
Tg:
100°C
Td: 300°C
Td: 300°C
Electrical Performance
Dk:
4.50
Df: 0.033
Df: 0.033
Industry Approvals
IPC-4101 /20
UL - File Number E41625
A11 products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.
Product Features
- Industry Recognition
- UL File Number: E41625
- RoHS Compliant
- Processing Advantages
- Complete encapsulation of non-planar surfaces
- Cure and form bond at low temperatures
- Allows for lamination at non-uniform pressures
- Adhesion to wide range of materials
- Flex films – (Mylar®, Kapton®, etc.)
- Treated or untreated copper
- Plated metals (tin, solder, nickel, etc.)
- Conventional laminate surfaces
Production & Manufacturing
Currently manufactured in North America
Product Availability
- Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
- Glass Fabric Availability
- E-glass
Property | Typical Value | Units | Test Method | |
---|---|---|---|---|
Metric (English) | IPC-TM-650 (or as noted) | |||
Pressed Thickness |
A. 104 B. 108
|
2.0 3.7
|
mm (mil) | — |
Resin Content |
A. 104 B. 108
|
75 65
|
% | 2.3.16.2 |
Resin Flow Testing |
A. 104 B. 108
|
2 | — | 2.3.17 |
Modified Circle Flow |
A. 104 B. 108
|
0.010 - 0.100 | — | — |
Glass Transition Temperature (Tg) by DSC | 100 | °C | 2.4.25C | |
Decomposition Temperature (Td) by TGA @ 5% weight loss | 300 | °C | 2.4.24.6 | |
Cure Temperature Recommended for Full Cure | 171 | — | — | |
Min. for Functional Bonding | 149 | — | — | |
Z-Axis CTE | 80 | ppm/°C | 2.4.24C | |
X/Y-Axis CTE | 18/16 | ppm/°C | 2.4.24C | |
Thermal Conductivity | 0.25 | W/m·K | ASTM E1952 | |
Dk, Permittivity | @ 1 GHz | 4.5 | — | 2.5.5.9 |
Df, Loss Tangent | @ 1 GHz | 0.033 | — | 2.5.5.9 |
Dielectric Breakdown | 80 | kV | 2.5.6B | |
Peel Strength | 1 oz. EDC foil | 9.0 | N/mm (lb/inch) | 2.4.8C |
Flammability (Laminate & laminated prepreg) | HB | Rating | UL 94 | |
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold. |
NOTE
Visit our site http://www.isola-group.com for more details.
Revisions:
A:Initial Release - 4/17
B:Corrected glass type PT,RC,RF 1080 to 108 - 3/19
Resource Title & Summary | Date Updated |
---|---|
A11 Processing Guide | 06/18/2020 |
A11 Prepreg Safety Data Sheet | 09/25/2019 |
A11 Prepreg RoHS Declaration | 12/14/2016 |
Resources
Laminate & Prepreg Manufacturing
This presentation describes the process of laminate and prepreg manufacturing.