FR408

Mid Loss, Epoxy Laminate and Prepreg

FR408 is a high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.

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Thermal Performance

Tg: 180°C
Td: 360°C

Electrical Performance

Dk: 3.67
Df: 0.0120

Industry Approvals

IPC-4101 /24 /121 /124
UL - File Number E41625

Its low dielectric constant (Dk) and low dissipation factor (Df) make it an
ideal candidate for broadband circuit designs requiring faster signal
speeds or improved signal integrity. FR408 is compatible with most
FR-4 processes. This feature allows the use of FR408 without
adding complexity to current fabrication techniques.

Attributes

Asset 7

Markets

AerospaceDefense ComputingStoragePeripherals NetworkingCommunications MedicalIndustrialInstrumentation

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Production & Manufacturing

Currently manufactured in Asia, North America, Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Heavier copper foil available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
15
 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
60
228
3.5
ppm/°C
ppm/°C
%
 2.4.24C
X/Y-Axis CTE Pre-Tg 13 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.69
3.66
3.67
3.66
3.65
 —
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0094
0.0117
0.0120
0.0127
0.0125
 —
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
4.6 x 107
2.8 x 108
 MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.81 x 106
2.64 x 108
 MΩ 2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 120 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 55 (1400) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.225 (7.0)
1.14 (6.5)
0.90 (5.1)
 N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
561 (81.4)
442 (64.1)
 MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
409 (59.3)
290 (42.0)
 MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3685
3044
 ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.162
0.138
 — ASTM D3039
Moisture Absorption 0.15 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19

Download Dk/Df Tables PDF

Core Data

Construction Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 Ghz
1x106 73.0% 0.002 0.051 3.36
0.0103		 3.32
0.0116		 3.31
0.0133		 3.29
0.0139		 3.27
0.0147		 3.26
0.0145
1x1080 59.0% 0.0027 0.069 3.63
0.0096		 3.61
0.0106		 3.60
0.0120		 3.58
0.0124		 3.57
0.0131		 3.56
0.0129
1x1080 64.0% 0.003 0.076 3.52
0.0100		 3.50
0.0110		 3.49
0.0124		 3.47
0.0129		 3.46
0.0137		 3.45
0.0135
2x106 67.0% 0.0035 0.089 3.46
0.0100		 3.44
0.0112		 3.43
0.0127		 3.41
0.0133		 3.39
0.0140		 3.38
0.0138
1x3313 49.0% 0.0035 0.089 3.86
0.0090		 3.84
0.0099		 3.83
0.0110		 3.82
0.0114		 3.80
0.0120		 3.80
0.0118
1x3313 54.0% 0.004 0.102 3.74
0.0093		 3.72
0.0103		 3.71
0.0115		 3.70
0.0119		 3.68
0.0125		 3.67
0.0124
2x106 70.0% 0.004 0.102 3.40
0.0101		 3.38
0.0114		 3.37
0.0130		 3.35
0.0136		 3.33
0.0144		 3.32
0.0142
1x3070 48.0% 0.004 0.102 3.88
0.0090		 3.87
0.0098		 3.86
0.0109		 3.84
0.0113		 3.83
0.0119		 3.82
0.0117
106/1080 61.0% 0.0043 0.109 3.58
0.0097		 3.56
0.0108		 3.55
0.0122		 3.54
0.0126		 3.52
0.0133		 3.51
0.0132
1x2116 52.0% 0.0048 0.122 3.76
0.0092		 3.74
0.0102		 3.73
0.0113		 3.72
0.0117		 3.71
0.0123		 3.70
0.0123
2x1080 57.0% 0.005 0.127 3.67
0.0095		 3.65
0.0105		 3.64
0.0118		 3.63
0.0122		 3.61
0.0129		 3.60
0.0127
1x2116 53.0% 0.005 0.127 3.76
0.0092		 3.74
0.0102		 3.73
0.0114		 3.72
0.0118		 3.71
0.0124		 3.70
0.0123
106/2113 56.0% 0.0053 0.135 3.69
0.0094		 3.67
0.0104		 3.66
0.0117		 3.65
0.0121		 3.63
0.0128		 3.63
0.0126
1x1652 46.0% 0.0055 0.14 3.94
0.0089		 3.92
0.0097		 3.91
0.0108		 3.90
0.0111		 3.88
0.0116		 3.88
0.0125
106/2113 58.0% 0.0055 0.14 3.65
0.0095		 3.63
0.0105		 3.62
0.0119		 3.60
0.0123		 3.59
0.0130		 3.58
0.0128
1080/2113 54.0% 0.006 0.152 3.74
0.0093		 3.72
0.0103		 3.71
0.0115		 3.70
0.0119		 3.68
0.0125		 3.67
0.0124
1x1652 50.0% 0.006 0.152 3.84
0.0091		 3.82
0.0100		 3.81
0.0111		 3.79
0.0115		 3.78
0.0121		 3.77
0.0119
2x1080 63.0% 0.006 0.152 3.54
0.0098		 3.52
0.0109		 3.51
0.0123		 3.49
0.0128		 3.48
0.0136		 3.47
0.0134
2x3313 54.0% 0.008 0.203 3.74
0.0093		 3.72
0.0103		 3.71
0.0115		 3.70
0.0119		 3.68
0.0125		 3.67
0.0124
2x2116 53.0% 0.01 0.254 3.75
0.0092		 3.73
0.0102		 3.72
0.0114		 3.71
0.0118		 3.69
0.0124		 3.68
0.0123
1x1080/2x2116 52.0% 0.012 0.305 3.76
0.0092		 3.74
0.0102		 3.73
0.0113		 3.72
0.0117		 3.71
0.0123		 3.70
0.0123
3x2116 52.0% 0.014 0.356 3.76
0.0092		 3.74
0.0102		 3.73
0.0113		 3.72
0.0117		 3.71
0.0123		 3.70
0.0123
2x7628/1080 42.0% 0.016 0.406 4.04
0.0087		 4.02
0.0094		 4.01
0.0104		 4.00
0.0107		 3.99
0.0112		 3.99
0.0110
2x7628/2116 41.0% 0.018 0.457 4.07
0.0086		 4.05
0.0094		 4.04
0.0103		 4.03
0.0106		 4.02
0.0111		 4.01
0.0109

Prepreg Data

Glass Style Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 GHz
106 75.0% 0.0023 0.058 3.31
0.0104		 3.28
0.0117		 3.27
0.0135		 3.25
0.0141		 3.23
0.0150		 3.23
0.0147
1080 65.0% 0.0031 0.079 3.50
0.0099		 3.48
0.0110		 3.47
0.0127		 3.45
0.0131		 3.43
0.0138		 3.43
0.0136
1080 68.0% 0.0034 0.086 3.44
0.0100		 3.42
0.0112		 3.41
0.0128		 3.39
0.0134		 3.37
0.0141		 3.36
0.0139
3313 53.0% 0.0037 0.094 3.76
0.0092		 3.74
0.0102		 3.73
0.0114		 3.72
0.0118		 3.71
0.0124		 3.70
0.0123
1080 71.0% 0.0038 0.097 3.38
0.0102		 3.35
0.0115		 3.35
0.0131		 3.33
0.0137		 3.31
0.0145		 3.30
0.0143
2113 57.0% 0.0040 0.102 3.67
0.0095		 3.65
0.0105		 3.64
0.0118		 3.63
0.0122		 3.61
0.0129		 3.60
0.0127
3313 59.0% 0.0041 0.104 3.74
0.0096		 3.72
0.0106		 3.71
0.0120		 3.70
0.0124		 3.68
0.0131		 3.67
0.0129
2116 56.0% 0.0051 0.130 3.69
0.0094		 3.67
0.0104		 3.66
0.0117		 3.65
0.0121		 3.63
0.0128		 3.63
0.0126
1652 50.0% 0.0058 0.147 3.84
0.0091		 3.82
0.0100		 3.81
0.0111		 3.79
0.0115		 3.78
0.0121		 3.77
0.0119
7628 44.0% 0.0071 0.180 3.99
0.0088		 3.97
0.0096		 3.96
0.0106		 3.95
0.0110		 3.94
0.0110		 3.93
0.0110

NOTE

Revisions:
A - Original Release - 4/17
B - Added Standard & Alternate construction-8/18

Resources

New Low Dielectric Constant, High Tg, Printed Circuitry Substrates

This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.

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