G200

BT-Epoxy Laminate and Prepreg

Isola’s G200 product is a fully proven laminate and prepreg system designed to meet today’s high reliability printed circuit board requirements.

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Thermal Performance

Tg: 180°C
Td: 325°C

Electrical Performance

Dk: 3.70
Df: 0.013

Industry Approvals

IPC-4101 /30
UL - File Number E41625

Blending Bismaleimide/Triazine (BT) and epoxy resin provides G200 with enhanced thermal, mechanical and electrical performance over most epoxy materials. G200 possesses performance characteristics that make it an excellent selection for large panel size, high layer count Printed Wiring Boards (PWB).

Attributes

Asset 7

Markets

AerospaceDefense

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
  • Copper Foil Type
    • HTE Grade 3
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 325 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>10
 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
275
3.30
ppm/°C
ppm/°C
%
 2.4.24C
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.35 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.80
3.70
3.70
3.65
3.65
 —
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0150
0.0150
0.0130
0.0150
0.0150
 —
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
8.9 x 108
6.5 x 108
 MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.21 x 106
4.4 x 108
 MΩ 2.5.17.1
Dielectric Breakdown >60 kV 2.5.6B
Arc Resistance 130 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1175) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. After process solutions

1.14 (6.5)

0.96 (5.5)
0.90 (5.1)
 N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
599 (86.9)
507 (73.6)
 MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
356 (51.6)
292 (42.4)
 MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3489
3200
 ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.182
0.160
 — ASTM D3039
Moisture Absorption 0.2 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19

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Laminates, Prepreg, & PCB Materials
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