G200

BT-Epoxy Laminate and Prepreg

Isola’s G200 product is a fully proven laminate and prepreg system designed to meet today’s high reliability printed circuit board requirements.

Thermal Performance

Tg: 180°C
Td: 325°C

Electrical Performance

Dk: 3.70
Df: 0.013

Industry Approvals

IPC-4101 /30
UL - File Number E41625

Blending Bismaleimide/Triazine (BT) and epoxy resin provides G200 with enhanced thermal, mechanical and electrical performance over most epoxy materials. G200 possesses performance characteristics that make it an excellent selection for large panel size, high layer count Printed Wiring Boards (PWB).

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 325 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>10
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
275
3.30
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.35 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.80
3.70
3.70
3.65
3.65
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0150
0.0150
0.0130
0.0150
0.0150
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
8.9 x 108
6.5 x 108
MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.21 x 106
4.4 x 108
2.5.17.1
Dielectric Breakdown >60 kV 2.5.6B
Arc Resistance 130 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1175) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. After process solutions

1.14 (6.5)

0.96 (5.5)
0.90 (5.1)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
86.9
73.6
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
51.6
42.4
ksi ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3489
3200
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.182
0.160
ASTM D3039
Moisture Absorption 0.2 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19

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Laminates, Prepreg, & PCB Materials
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