IS415

High Thermal Performance Epoxy Laminate and Prepreg

IS415 sets the industry standard for high thermal performance epoxy materials and is ideally suited for designs requiring high signal integrity.

Thermal Performance

Tg: 200°C
Td: 370°C

Electrical Performance

Dk: 3.72
Df: 0.0120

Industry Approvals

IPC-4101 /98 /99 /101 /126
UL - File Number E41625

This product is engineered to meet the demands of Lead (Pb) free multilayer printed circuit assembly, deliver CAF resistance with strong IST results and maintain FR-4 processing. IS415 offers good electrical performance, superior chemical and thermal performance and product consistency.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence
    • No post bake after pressing

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 370 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>20
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
240
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 13 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.75
3.71
3.72
3.71
3.71
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0107
0.0131
0.0120
0.0127
0.0125
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
3.81 x 108
3.90 x 108
MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.81 x 106
2.64 x 108
2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 120 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 40 (1100) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 1 (400-600) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.225 (7.0)
1.14 (6.5)
0.90 (5.1)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
74.2
51.6
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
43.8
31.5
ksi ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3530
3200
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.158
0.138
ASTM D3039
Moisture Absorption 0.15 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Corrected CTI from 3 to 1 2/20

Core Data

Construction Resin content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 GHz
1x106 73.0% 0.0020 0.051 3.39
0.0112
3.37
0.0125
3.36
0.0143
3.34
0.0149
3.32
0.0152
3.31
0.0152
1x1067 70.0% 0.0025 0.064 3.45
0.0112
3.43
0.0113
3.41
0.0127
3.40
0.0131
3.38
0.0134
3.37
0.0134
1x1080 57.0% 0.0025 0.064 3.72
0.0110
3.70
0.0123
3.69
0.0140
3.67
0.0146
3.66
0.0149
3.65
0.0149
1x1080 63.0% 0.0030 0.076 3.59
0.0106
3.57
0.0118
3.56
0.0133
3.54
0.0138
3.53
0.0141
3.52
0.0141
2x106 66.0% 0.0035 0.089 3.53
0.0108
3.51
0.0120
3.50
0.0136
3.48
0.0141
3.46
0.0144
3.45
0.0144
1x3313 51.0% 0.0035 0.089 3.86
0.0099
3.84
0.0108
3.83
0.0120
3.82
0.0125
3.80
0.0127
3.80
0.0127
1x1086 64.0% 0.0035 0.089 3.57
0.0106
3.55
0.0118
3.54
0.0133
3.52
0.0139
3.50
0.0142
3.50
0.0142
1x3313 54.0% 0.0040 0.102 3.79
0.0101
3.77
0.0111
3.76
0.0123
3.74
0.0128
3.73
0.0130
3.72
0.0130
2x106 71.0% 0.0045 0.114 3.43
0.0098
3.41
0.0107
3.40
0.0118
3.38
0.0122
3.36
0.0125
3.35
0.0125
1x2116 49.0% 0.0045 0.114 3.91
0.0098
3.89
0.0107
3.88
0.0118
3.87
0.0122
3.85
0.0125
3.85
0.0125
106/1067 71.0% 0.0045 0.114 3.43
0.0110
3.41
0.0124
3.40
0.0141
3.38
0.0147
3.36
0.0150
3.35
0.0150
2x1080 57.0% 0.0050 0.127 3.72
0.0112
3.70
0.0113
3.69
0.0127
3.67
0.0131
3.66
0.0134
3.65
0.0134
1x2116 54.0% 0.0050 0.127 3.79
0.0101
3.77
0.0111
3.76
0.0123
3.74
0.0128
3.73
0.0130
3.73
0.0130
2x1067 70.0% 0.0050 0.127 3.45
0.0110
3.43
0.0123
3.41
0.0140
3.40
0.0146
3.38
0.0149
3.37
0.0149
106/1080 67.0% 0.0053 0.135 3.51
0.0108
3.49
0.0121
3.48
0.0137
3.46
0.0142
3.44
0.0145
3.43
0.0145
106/3313 56.0% 0.0055 0.140 3.75
0.0102
3.72
0.0112
3.71
0.0126
3.70
0.0130
3.68
0.0133
3.68
0.0133
2x1080 63.0% 0.0060 0.152 3.59
0.0106
3.57
0.0118
3.56
0.0133
3.54
0.0138
3.53
0.0141
3.53
0.0141
2x1086 64.0% 0.0070 0.178 3.57
0.0106
3.55
0.0118
3.54
0.0133
3.52
0.0139
3.50
0.0142
3.50
0.0142
2x3313 51.0% 0.0070 0.178 3.86
0.0099
3.84
0.0108
3.83
0.0120
3.82
0.0125
3.80
0.0127
3.80
0.0127
2x3313 54.0% 0.0080 0.203 3.79
0.0101
3.77
0.0111
3.76
0.0123
3.74
0.0128
3.73
0.0130
3.73
0.0130
2x2116 54.0% 0.0100 0.254 3.79
0.0101
3.77
0.0111
3.76
0.0123
3.74
0.0128
3.73
0.0130
3.73
0.0130
3x3313 54.0% 0.0120 0.305 3.79
0.0101
3.77
0.0111
3.76
0.0123
3.74
0.0128
3.73
0.0130
3.73
0.0130
2x2116/3313 54.0% 0.0140 0.356 3.79
0.0101
3.77
0.0111
3.76
0.0123
3.74
0.0128
3.73
0.0130
3.73
0.0130
2x2116/7628 45.0% 0.0160 0.406 4.01
0.0096
3.99
0.0104
3.98
0.0114
3.97
0.0118
3.96
0.0120
3.95
0.0120
3313/2x7628 43.0% 0.0180 0.457 4.05
0.0095
4.03
0.0103
4.02
0.0112
4.00
0.0170
4.01
0.0118
3.99
0.0118

Prepreg Data

Glass Style Resin content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 GHz
106 75.0% 0.0024 0.061 3.36
0.0113
3.33
0.0127
3.32
0.0145
3.30
0.0151
3.28
0.0155
3.27
0.0155
1067 70.0% 0.0024 0.061 3.45
0.0110
3.43
0.0123
3.41
0.0140
3.40
0.0146
3.38
0.0149
3.38
0.0149
1080 65.0% 0.0031 0.079 3.55
0.0107
3.53
0.0119
3.52
0.0135
3.50
0.0140
3.48
0.0143
3.48
0.0143
1080 68.0% 0.0035 0.089 3.49
0.0109
3.47
0.0121
3.45
0.0138
3.44
0.0143
3.42
0.0147
3.41
0.0146
1086 64.0% 0.0038 0.097 3.57
0.0106
3.55
0.0118
3.54
0.0134
3.52
0.0139
3.50
0.0142
3.50
0.0142
3313 54.0% 0.0039 0.099 3.79
0.0101
3.77
0.0111
3.76
0.0123
3.74
0.0128
3.73
0.0130
3.72
0.0130
3313 59.0% 0.0045 0.114 3.68
0.0104
3.66
0.0115
3.65
0.0129
3.63
0.0133
3.61
0.0136
3.61
0.0136
3313 61.0% 0.0048 0.122 3.64
0.0105
3.61
0.0115
3.60
0.0129
3.59
0.0133
3.57
0.0136
3.56
0.0136
2116 57.0% 0.0053 0.135 3.72
0.0102
3.70
0.0113
3.69
0.0127
3.67
0.0131
3.66
0.0134
3.65
0.0134
1652 50.0% 0.0059 0.150 3.89
0.0098
3.87
0.0108
3.86
0.0119
3.84
0.0123
3.83
0.0126
3.82
0.0126

NOTE

Revisions:
A - Original Release - 4/17

Resources

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials
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