IS680 AG

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IS680 AG

Very Low-Loss Laminate

IS680 AG laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 200°C Td: 360°C	Dk: 3.00 / 3.38 / 3.45 / 3.48 Df: 0.0020 - 0.0029	IPC-4103 /17 UL - File Number E41625

Thermal Performance

Tg: 200°C
Td: 360°C

Electrical Performance

Dk: 3.00 / 3.38 / 3.45 / 3.48
Df: 0.0020 - 0.0029

Industry Approvals

IPC-4103 /17

UL - File Number E41625

IS680 AG is suitable for many of today’s commercial RF/ microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, IS680AG offers an ultra-low dissipation factor (Df), making it an extremely cost-effective alternative to PTFE and other commercial microwave laminate materials in double sided applications.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Processing Advantages
- FR-4 process compatible
- Reduced drill wear
- No plasma desmear required
- Consistent dielectric spacing

Production & Manufacturing

Currently manufactured in Europe

Product Availability

Standard Material Offering: Laminate
- 20, 30, 60 mil (0.51, 0.76, 1.5 mm)

Copper Foil Type
- HVLP (VLP2) ≤2.5 micron Rz JIS

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Square weave glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		200	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss		360	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	>60	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	44.7 191 2.9	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE	Pre-Tg	12	ppm/°C	2.4.24C
Thermal Conductivity		0.38 - 0.53	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	@ 10 GHz	3.00	—	2.5.5.5
Df, Loss Tangent	@ 10 GHz	0.0020	—	Bereskin Stripline
Dk, Permittivity	@ 10 GHz	3.38	—	2.5.5.5
Df, Loss Tangent	@ 10 GHz	0.0026	—	Bereskin Stripline
Dk, Permittivity	@ 10 GHz	3.45	—	2.5.5.5
Df, Loss Tangent	@ 10 GHz	0.0026	—	Bereskin Stripline
Dk, Permittivity	@ 10 GHz	3.48	—	2.5.5.5
Df, Loss Tangent	@ 10 GHz	0.0029	—	Bereskin Stripline
Volume Resistivity	C-96/35/90	1.33 x 10⁷	MΩ-cm	2.5.17.1
Surface Resistivity	C-96/35/90	1.33 x 10⁵	MΩ	2.5.17.1
Dielectric Breakdown		45.4	kV	2.5.6B
Arc Resistance		139	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		45 (1133)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		2	Class (Volts)	UL 746A ASTM D3638
Peel Strength	1 oz. EDC foil	0.70 (4.01)	N/mm (lb/inch)	2.4.8.2A
Flexural Strength	A. Length direction B. Cross direction	259 (37.5) 197 (28.5)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	193 (28.0) 179 (26.0)	MPa (kpsi)	ASTM D3039
Poisson's Ratio	A. Length direction B. Cross direction	0.122 0.120	—	ASTM D3039
Moisture Absorption		0.10	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		110	°C	UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Changed VLP2 to HVLP to align with common industry terms 4/21
E: Corrected RTI Value

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Thickness (inch)	Thickness (mm)	2 GHz	5 GHz	10 GHz	15 GHz	20 GHz
Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
0.020	0.508	3.00 0.0020	3.00 0.0020	3.00 0.0020	3.00 0.0020	3.00 0.0020
0.030	0.762	3.00 0.0020	3.00 0.0020	3.00 0.0020	3.00 0.0020	3.00 0.0020
0.060	1.524	3.00 0.0020	3.00 0.0020	3.00 0.0020	3.00 0.0020	3.00 0.0020
0.030	0.762	3.38 0.0026	3.38 0.0026	3.38 0.0026	3.38 0.0026	3.38 0.0026
0.060	1.524	3.38 0.0026	3.38 0.0026	3.38 0.0026	3.38 0.0026	3.38 0.0026
0.030	0.762	3.45 0.0026	3.45 0.0026	3.45 0.0026	3.45 0.0026	3.45 0.0026
0.060	1.524	3.45 0.0026	3.45 0.0026	3.45 0.0026	3.45 0.0026	3.45 0.0026
0.060	1.524	3.48 0.0029	3.48 0.0029	3.48 0.0029	3.48 0.0029	3.48 0.0029

NOTE

Revisions:
A: Original Release - 4/17

Documentation ▼

Resource Title & Summary	Date Updated
IS680 AG Processing Guide	06/30/2020
IS680 AG Laminate Safety Data Sheet	07/21/2020
IS680 AG Laminate RoHS Declaration	11/01/2022

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Property		IS680 AG
Recommended for New Design
Halogen Free		—
Glass Transition Temperature (Tg) by DSC	Resin Content	200
Dk, Permittivity	Resin Content	3.48
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	360
Df, Loss Tangent	Resin Content	0.0029
Moisture Absorption	Resin Content	0.10
Z-Axis CTE	50 to 260°C, (Total Expansion)	2.9
Peel Strength	Standard profile copper >>> After thermal stress	0.70 (4.01)

IS680 AG

Very Low-Loss Laminate

IS680 AG laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

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