TerraGreen®
Halogen-free, Very Low Loss Laminate and Prepreg
TerraGreen® laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
Thermal Performance |
Electrical Performance |
Industry Approvals |
Tg:
200°C
Td: 390°C |
Dk:
3.44
Df: 0.0032 |
UL - File Number E41625
|
Thermal Performance
Td: 390°C
Electrical Performance
Df: 0.0032
Industry Approvals
TerraGreen® is engineered for such highperformance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz.
TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.
TerraGreen® meets UL 94 V-0 and is halogen free.
Product Features
- Industry Recognition
- RoHS Compliant
- Performance Attributes
- Lead-free assembly compatible
- Processing Advantages
- FR-4 process compatible
- UV blocking and AOI fluorescence
Production & Manufacturing
Currently manufactured in Europe
Product Availability
- Standard Material Offering: Laminate
- 2 to 18 mil (0.05 to 0.46 mm)
- Copper Foil Type
- HTE Grade 3
- HVLP (VLP2) ≤2.5 micron Rz JIS
- Copper Weight
- ½, 1 oz (18 and 35 µm) available
- Heavier copper foil available
- Thinner copper foil available
- Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging
- Glass Fabric Availability
- E-glass
- Square weave glass
- Mechanically spread glass
Property | Typical Value | Units | Test Method | |
---|---|---|---|---|
Metric (English) | IPC-TM-650 (or as noted) | |||
Glass Transition Temperature (Tg) by DSC | 200 | °C | 2.4.25C | |
Decomposition Temperature (Td) by TGA @ 5% weight loss | 390 | °C | 2.4.24.6 | |
Time to Delaminate by TMA (Copper removed) |
A. T260 B. T288
|
60 | Minutes | 2.4.24.1 |
Z-Axis CTE | 50 to 260°C, (Total Expansion) | 2.9 | % | 2.4.24C |
X/Y-Axis CTE | Pre-Tg | 16 | ppm/°C | 2.4.24C |
Thermal Conductivity | 0.32 | W/m·K | ASTM E1952 | |
Thermal Stress 10 sec @ 288ºC (550.4ºF) |
A. Unetched B. Etched
|
Pass | Pass Visual | 2.4.13.1 |
Dk, Permittivity |
A. @ 2 GHz B. @ 5 GHz C. @ 10 GHz
|
3.44 | — | 2.5.5.5 |
Df, Loss Tangent |
A. @ 2 GHz B. @ 5 GHz C. @ 10 GHz
|
0.0033 0.0032 0.0032
|
— | Bereskin Stripline |
Volume Resistivity | C-96/35/90 | 1.33 x 107 | MΩ-cm | 2.5.17.1 |
Surface Resistivity | C-96/35/90 | 1.33 x 105 | MΩ | 2.5.17.1 |
Dielectric Breakdown | 45.4 | kV | 2.5.6B | |
Arc Resistance | 139 | Seconds | 2.5.1B | |
Electric Strength (Laminate & laminated prepreg) | 45 (1133) | kV/mm (V/mil) | 2.5.6.2A | |
Comparative Tracking Index (CTI) | 2 | Class (Volts) |
UL 746A ASTM D3638 |
|
Peel Strength |
A. 0.5 oz. EDC foil B. 1 oz. EDC foil
|
0.88 (5.0) |
N/mm (lb/inch) | 2.4.8C |
Flexural Strength |
A. Length direction B. Cross direction
|
521 (75.5) 514 (60.0)
|
MPa (kpsi) | 2.4.4B |
Tensile Strength |
A. Length direction B. Cross direction
|
276 (40.0) 269 (39.0)
|
MPa (kpsi) | ASTM D3039 |
Young's Modulus |
A. Length direction B. Cross direction
|
3125 2745
|
ksi | ASTM D790-15e2 |
Poisson's Ratio |
A. Length direction B. Cross direction
|
0.238 0.231
|
— | ASTM D3039 |
Moisture Absorption | 0.05 | % | 2.6.2.1A | |
Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold. |
NOTE
Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Added CTI value 01/20
E: Changed VLP2 to HVLP to align with common industry terms 4/21
F: Correct data sheet Df values to match Construction table 12/22
Core Data
Construction | Resin Content % | Offering | Thickness (inch) | Thickness (mm) | Dielectric Constant (DK)/ Dissipation Factor (DF) | ||||
---|---|---|---|---|---|---|---|---|---|
2 Ghz | 5 Ghz | 10 GHz | 15 Ghz | 20 Ghz | |||||
1x1035 | 67.0% | Standard | 0.0020 | 0.051 | 3.31 0.0029 |
3.31 0.0030 |
3.31 0.0030 |
3.31 0.0030 |
3.31 0.0030 |
1x1035 | 70.5% | Alternate | 0.0025 | 0.064 | 3.24 0.0027 |
3.24 0.0028 |
3.24 0.0028 |
3.23 0.0028 |
3.23 0.0028 |
1x1078 | 63.0% | Standard | 0.0030 | 0.076 | 3.40 0.0031 |
3.40 0.0032 |
3.40 0.0032 |
3.40 0.0032 |
3.40 0.0032 |
1x1078 | 67.5% | Alternate | 0.0035 | 0.089 | 3.30 0.0029 |
3.30 0.0030 |
3.30 0.0030 |
3.30 0.0030 |
3.30 0.0030 |
1x3313 | 54.5% | Standard | 0.0040 | 0.102 | 3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
2x1067 | 64.0% | Alternate | 0.0040 | 0.102 | 3.38 0.0031 |
3.38 0.0031 |
3.38 0.0031 |
3.38 0.0031 |
3.38 0.0031 |
1x3313 | 58.0% | Standard | 0.0045 | 0.114 | 3.50 0.0034 |
3.50 0.0035 |
3.50 0.0035 |
3.50 0.0035 |
3.50 0.0035 |
2x1067 | 67.0% | Alternate | 0.0045 | 0.114 | 3.31 0.0029 |
3.31 0.0030 |
3.31 0.0030 |
3.31 0.0030 |
3.31 0.0030 |
1x3313 | 62.0% | Standard | 0.0050 | 0.127 | 3.42 0.0032 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
2x1078 | 57.0% | Alternate | 0.0050 | 0.127 | 3.54 0.0035 |
3.54 0.0035 |
3.54 0.0035 |
3.54 0.0035 |
3.54 0.0035 |
2x1078 | 60.0% | Alternate | 0.0055 | 0.140 | 3.48 0.0035 |
3.48 0.0035 |
3.48 0.0035 |
3.48 0.0035 |
3.48 0.0035 |
1x2116 | 60.0% | Standard | 0.0060 | 0.152 | 3.47 0.0035 |
3.47 0.0035 |
3.47 0.0035 |
3.47 0.0035 |
3.47 0.0035 |
2x1078 | 63.0% | Alternate | 0.0060 | 0.157 | 3.40 0.0031 |
3.40 0.0032 |
3.40 0.0032 |
3.40 0.0032 |
3.40 0.0032 |
2x1078 | 67.5% | Standard | 0.0070 | 0.178 | 3.30 0.0029 |
3.30 0.0030 |
3.30 0.0030 |
3.30 0.0030 |
3.30 0.0030 |
2x3313 | 54.5% | Alternate | 0.0080 | 0.203 | 3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
2x3313 | 62.0% | Standard | 0.0100 | 0.254 | 3.42 0.0032 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
3x1078 | 66.0% | Alternate | 0.0100 | 0.254 | 3.61 0.0030 |
3.61 0.0032 |
3.61 0.0032 |
3.61 0.0032 |
3.61 0.0032 |
3x3313 | 54.5% | Standard | 0.0120 | 0.305 | 3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
3.60 0.0037 |
2x3313/1078 | 64.5% | Standard | 0.0140 | 0.356 | 3.37 0.0031 |
3.37 0.0031 |
3.37 0.0031 |
3.36 0.0031 |
3.36 0.0031 |
2x1078/2x3313 | 62.4% | Standard | 0.0160 | 0.406 | 3.42 0.0032 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
4x3313 | 58.5% | Standard | 0.0180 | 0.457 | 3.50 0.0034 |
3.50 0.0035 |
3.50 0.0035 |
3.50 0.0035 |
3.50 0.0035 |
4x3313 | 62.0% | Standard | 0.0200 | 0.508 | 3.42 0.0032 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
Prepreg Data
Glass Style | Resin Content % | Offering | Thickness (inch) | Thickness (mm) | Dielectric Constant (DK)/ Dissipation Factor (DF) | ||||
---|---|---|---|---|---|---|---|---|---|
2 Ghz | 5 Ghz | 10 GHz | 15 Ghz | 20 Ghz | |||||
106 | 73.0% | Standard | 0.0023 | 0.058 | 3.18 0.0025 |
3.18 0.0026 |
3.18 0.0026 |
3.18 0.0026 |
3.18 0.0026 |
1067 | 70.0% | Standard | 0.0025 | 0.064 | 3.25 0.0027 |
3.25 0.0028 |
3.25 0.0028 |
3.25 0.0028 |
3.24 0.0028 |
1078 | 60.0% | Standard | 0.0028 | 0.071 | 3.47 0.0033 |
3.47 0.0034 |
3.47 0.0034 |
3.47 0.0034 |
3.47 0.0034 |
1067 | 73.0% | Standard | 0.0029 | 0.074 | 3.18 0.0025 |
3.18 0.0026 |
3.18 0.0026 |
3.18 0.0026 |
3.18 0.0026 |
1078 | 63.0% | Alternate | 0.0031 | 0.079 | 3.40 0.0031 |
3.40 0.0032 |
3.40 0.0032 |
3.40 0.0032 |
3.40 0.0032 |
1078 | 67.0% | Standard | 0.0035 | 0.089 | 3.31 0.0029 |
3.31 0.0030 |
3.31 0.0030 |
3.31 0.0030 |
3.31 0.0030 |
1080 | 68.0% | Alternate | 0.0036 | 0.091 | 3.29 0.0028 |
3.29 0.0029 |
3.29 0.0029 |
3.29 0.0029 |
3.29 0.0029 |
1080 | 71.0% | Standard | 0.0040 | 0.102 | 3.22 0.0027 |
3.22 0.0027 |
3.22 0.0027 |
3.22 0.0027 |
3.22 0.0027 |
1078 | 71.0% | Standard | 0.0041 | 0.104 | 3.22 0.0027 |
3.22 0.0027 |
3.22 0.0027 |
3.22 0.0027 |
3.22 0.0027 |
3313 | 62.0% | Standard | 0.0051 | 0.130 | 3.42 0.0032 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
3.42 0.0033 |
3313 | 65.0% | Standard | 0.0056 | 0.142 | 3.35 0.0030 |
3.35 0.0031 |
3.35 0.0031 |
3.35 0.0031 |
3.35 0.0031 |
2116 | 60.0% | Alternate | 0.0061 | 0.155 | 3.47 0.0033 |
3.47 0.0034 |
3.47 0.0034 |
3.47 0.0034 |
3.47 0.0034 |
NOTE
Revisions:
A-Original Release - 4/17
B-Adjusted 16.8 mil thickness to 16.6 mil thickness -12/19
C-Rationalized construction set - 5/21
All TerraGreen glass is Spread Weave in both directions
Standard-Commonly available
Alternate-Available, but not stocked
Resource Title & Summary | Date Updated |
---|---|
TerraGreen® Prepreg Supplemental | 10/16/2021 |
Isola Laminate Outgassing Data Properties | 12/17/2019 |
TerraGreen® Processing Guide | 06/30/2020 |
TerraGreen Laminate Safety Data Sheet | 07/21/2020 |
TerraGreen® Prepreg Safety Data Sheet | 07/21/2020 |
TerraGreen® Laminate RoHS Declaration | 11/01/2022 |
TerraGreen® Prepreg RoHS Declaration | 11/01/2022 |
Resources
High Tg Bromine-free Laminates for PWB Applications
This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.
Halogen Free Base Materials for PWB Applications
This paper discusses the challenges and concerns of commercially-available non-halogen materials.
Meeting Flame Resistance Requirements for Green Electronics
This presentation discusses challenges and opportunities for halogen-free laminates.
Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications
This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.
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