TerraGreen®

Halogen-free, Very Low Loss Laminate and Prepreg

TerraGreen® laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

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Thermal Performance

Tg: 200°C
Td: 390°C

Electrical Performance

Dk: 3.44
Df: 0.0032

Industry Approvals

UL - File Number E41625

TerraGreen® is engineered for such highperformance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz.

TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.

TerraGreen® meets UL 94 V-0 and is halogen free.

Attributes

HighThermalReliability HighSpeedDigital Asset 12

Markets

ComputingStoragePeripherals NetworkingCommunications

Product Features

  • Industry Recognition
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Production & Manufacturing

Currently manufactured in Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HTE Grade 3
    • HVLP (VLP2) ≤2.5 micron Rz JIS
  • Copper Weight
    • ½, 1 oz (18 and 35 µm) available
    • Heavier copper foil available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 390 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
 60 Minutes 2.4.24.1
Z-Axis CTE 50 to 260°C, (Total Expansion) 2.9 % 2.4.24C
X/Y-Axis CTE Pre-Tg 16 ppm/°C 2.4.24C
Thermal Conductivity 0.32 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
 3.44 — 2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
0.0033
0.0032
0.0032
 — Bereskin Stripline
Volume Resistivity C-96/35/90 1.33 x 107 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33 x 105 MΩ 2.5.17.1
Dielectric Breakdown 45.4 kV 2.5.6B
Arc Resistance 139 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1133) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. 0.5 oz. EDC foil
B. 1 oz. EDC foil
0.88 (5.0) 		N/mm (lb/inch) 2.4.8C
Flexural Strength
A. Length direction
B. Cross direction
521 (75.5)
514 (60.0)
 MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
276 (40.0)
269 (39.0)
 MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3125
2745
 ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.238
0.231
 — ASTM D3039
Moisture Absorption 0.05 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Added CTI value 01/20
E: Changed VLP2 to HVLP to align with common industry terms 4/21
F: Correct data sheet Df values to match Construction table 12/22

Download Dk/Df Tables PDF

Core Data

Construction Resin Content % Offering Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 Ghz 5 Ghz 10 GHz 15 Ghz 20 Ghz
1x1035 67.0% Standard 0.0020 0.051 3.31
0.0029		 3.31
0.0030		 3.31
0.0030		 3.31
0.0030		 3.31
0.0030
1x1035 70.5% Alternate 0.0025 0.064 3.24
0.0027		 3.24
0.0028		 3.24
0.0028		 3.23
0.0028		 3.23
0.0028
1x1078 63.0% Standard 0.0030 0.076 3.40
0.0031		 3.40
0.0032		 3.40
0.0032		 3.40
0.0032		 3.40
0.0032
1x1078 67.5% Alternate 0.0035 0.089 3.30
0.0029		 3.30
0.0030		 3.30
0.0030		 3.30
0.0030		 3.30
0.0030
1x3313 54.5% Standard 0.0040 0.102 3.60
0.0037		 3.60
0.0037		 3.60
0.0037		 3.60
0.0037		 3.60
0.0037
2x1067 64.0% Alternate 0.0040 0.102 3.38
0.0031		 3.38
0.0031		 3.38
0.0031		 3.38
0.0031		 3.38
0.0031
1x3313 58.0% Standard 0.0045 0.114 3.50
0.0034		 3.50
0.0035		 3.50
0.0035		 3.50
0.0035		 3.50
0.0035
2x1067 67.0% Alternate 0.0045 0.114 3.31
0.0029		 3.31
0.0030		 3.31
0.0030		 3.31
0.0030		 3.31
0.0030
1x3313 62.0% Standard 0.0050 0.127 3.42
0.0032		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033
2x1078 57.0% Alternate 0.0050 0.127 3.54
0.0035		 3.54
0.0035		 3.54
0.0035		 3.54
0.0035		 3.54
0.0035
2x1078 60.0% Alternate 0.0055 0.140 3.48
0.0035		 3.48
0.0035		 3.48
0.0035		 3.48
0.0035		 3.48
0.0035
1x2116 60.0% Standard 0.0060 0.152 3.47
0.0035		 3.47
0.0035		 3.47
0.0035		 3.47
0.0035		 3.47
0.0035
2x1078 63.0% Alternate 0.0060 0.157 3.40
0.0031		 3.40
0.0032		 3.40
0.0032		 3.40
0.0032		 3.40
0.0032
2x1078 67.5% Standard 0.0070 0.178 3.30
0.0029		 3.30
0.0030		 3.30
0.0030		 3.30
0.0030		 3.30
0.0030
2x3313 54.5% Alternate 0.0080 0.203 3.60
0.0037		 3.60
0.0037		 3.60
0.0037		 3.60
0.0037		 3.60
0.0037
2x3313 62.0% Standard 0.0100 0.254 3.42
0.0032		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033
3x1078 66.0% Alternate 0.0100 0.254 3.61
0.0030		 3.61
0.0032		 3.61
0.0032		 3.61
0.0032		 3.61
0.0032
3x3313 54.5% Standard 0.0120 0.305 3.60
0.0037		 3.60
0.0037		 3.60
0.0037		 3.60
0.0037		 3.60
0.0037
2x3313/1078 64.5% Standard 0.0140 0.356 3.37
0.0031		 3.37
0.0031		 3.37
0.0031		 3.36
0.0031		 3.36
0.0031
2x1078/2x3313 62.4% Standard 0.0160 0.406 3.42
0.0032		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033
4x3313 58.5% Standard 0.0180 0.457 3.50
0.0034		 3.50
0.0035		 3.50
0.0035		 3.50
0.0035		 3.50
0.0035
4x3313 62.0% Standard 0.0200 0.508 3.42
0.0032		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033

Prepreg Data

Glass Style Resin Content % Offering Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 Ghz 5 Ghz 10 GHz 15 Ghz 20 Ghz
106 73.0% Standard 0.0023 0.058 3.18
0.0025		 3.18
0.0026		 3.18
0.0026		 3.18
0.0026		 3.18
0.0026
1067 70.0% Standard 0.0025 0.064 3.25
0.0027		 3.25
0.0028		 3.25
0.0028		 3.25
0.0028		 3.24
0.0028
1078 60.0% Standard 0.0028 0.071 3.47
0.0033		 3.47
0.0034		 3.47
0.0034		 3.47
0.0034		 3.47
0.0034
1067 73.0% Standard 0.0029 0.074 3.18
0.0025		 3.18
0.0026		 3.18
0.0026		 3.18
0.0026		 3.18
0.0026
1078 63.0% Alternate 0.0031 0.079 3.40
0.0031		 3.40
0.0032		 3.40
0.0032		 3.40
0.0032		 3.40
0.0032
1078 67.0% Standard 0.0035 0.089 3.31
0.0029		 3.31
0.0030		 3.31
0.0030		 3.31
0.0030		 3.31
0.0030
1080 68.0% Alternate 0.0036 0.091 3.29
0.0028		 3.29
0.0029		 3.29
0.0029		 3.29
0.0029		 3.29
0.0029
1080 71.0% Standard 0.0040 0.102 3.22
0.0027		 3.22
0.0027		 3.22
0.0027		 3.22
0.0027		 3.22
0.0027
1078 71.0% Standard 0.0041 0.104 3.22
0.0027		 3.22
0.0027		 3.22
0.0027		 3.22
0.0027		 3.22
0.0027
3313 62.0% Standard 0.0051 0.130 3.42
0.0032		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033		 3.42
0.0033
3313 65.0% Standard 0.0056 0.142 3.35
0.0030		 3.35
0.0031		 3.35
0.0031		 3.35
0.0031		 3.35
0.0031
2116 60.0% Alternate 0.0061 0.155 3.47
0.0033		 3.47
0.0034		 3.47
0.0034		 3.47
0.0034		 3.47
0.0034

NOTE

Revisions:
A-Original Release - 4/17
B-Adjusted 16.8 mil thickness to 16.6 mil thickness -12/19
C-Rationalized construction set - 5/21
All TerraGreen glass is Spread Weave in both directions
Standard-Commonly available
Alternate-Available, but not stocked

Resources

High Tg Bromine-free Laminates for PWB Applications

This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

Halogen Free Base Materials for PWB Applications

This paper discusses the challenges and concerns of commercially-available non-halogen materials.

Meeting Flame Resistance Requirements for Green Electronics

This presentation discusses challenges and opportunities for halogen-free laminates.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

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