Medical, Industrial & Instrumentation

Isola’s portfolio of high reliability, low loss materials support a variety of medical applications, including hybrid devices, implantable devices, monitoring and imaging systems with telecom and data processing capability and other smart devices.

Isola Features:

  • HDI microvia capability
  • Multilayer capability
  • Low outgassing
  • Hybrid capability with Flex materials
  • Multi-lamination capability
  • Surface Mount (SMT) capable

Typical Applications:

  • Lab diagnostic equipment
  • Defibrillators
  • Handheld wireless devices
  • Pacemakers
  • MRI machines
  • CT and X-ray machines

Attributes

DE104
Tg: 135°C
Td: 315°C
Dk: 4.37
Df: 0.022
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I-Tera® MT40 (RF/MW)
Tg: 200°C
Td: 360°C
Dk: 3.38 / 3.45 / 3.60 / 3.75
Df: 0.0028 - 0.0035
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I-Speed®
Tg: 180°C
Td: 360°C
Dk: 3.64
Df: 0.0060
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I-Tera® MT40
Tg: 200°C
Td: 360°C
Dk: 3.45
Df: 0.0031
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ED130UV
Tg: 135°C
Dk: 4.35
Df: 0.017
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FR408HR
Tg: 190°C
Td: 360°C
Dk: 3.68
Df: 0.0092
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370HR
Tg: 180°C
Td: 340°C
Dk: 4.04
Df: 0.0210
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IS410
Tg: 180°C
Td: 350°C
Dk: 3.97
Df: 0.0200
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FR408
Tg: 180°C
Td: 360°C
Dk: 3.67
Df: 0.0120
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185HR
Tg: 180°C
Td: 340°C
Dk: 4.01
Df: 0.0200
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P25N
Tg: 250°C
Td: 383°C
Dk: 3.67
Df: 0.0187
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Resources

Thermal Management of PCBs in Embedded Systems

This presentation discusses thermal management considerations for embedded systems.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

Coated Copper Foils for High Density Interconnects

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability

This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.

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