I-Tera® MT40 (RF/MW)
Very Low-Loss Laminate Material
| Thermal Performance | Electrical Performance | Industry Approvals | ||
|---|---|---|---|---|
|
Tg 200°C |
Td 360°C |
Dk 3.38 / 3.45 / 3.60 / 3.75 |
Df 0.0028 - 0.0035 | IPC-4103 /17 UL - File Number E41625 |
I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between -40°C and +140°C up to W-band frequencies. In addition, I-Tera MT40 offers a very low dissipation factor (Df) of 0.0028 – 0.0035 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.
I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.
Product Attributes
Typical Market Applications
Product Features
-
Industry Recognition
- UL File Number: E41625
- RoHS Compliant
-
Performance Attributes
- CAF resistant
- Lead-free assembly compatible
-
Processing Advantages
- FR-4 process compatible
- Dimensional stability
- Multiple reflow capable
- Multiple lamination cycles
Product Availability
-
Standard Material Offering: Laminate
- 10, 20, 30, 60 mil (0.25, 0.51, 0.76, 1.5 mm)
- Available in full size sheet or panel form
-
Copper Foil Type
- HTE Grade 3
- VLP-2 (2 micron), 1 oz and below
- RTF (Reverse Treat Foil)
-
Copper Weight
- ½ to 2 oz (18 to 70 µm) available
- Heavier copper available
- Thinner copper foil available
-
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
-
Glass Fabric Availability
- Square weave glass
- Mechanically spread glass
Production & Manufacturing
- Currently manufactured in North America, Europe
| Property | Typical Value | Units | Test Method | |
|---|---|---|---|---|
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 200 | °C | 2.4.25C | |
| Glass Transition Temperature (Tg) by TMA | 205 | °C | 2.4.24C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) | A. T260 B. T288 | >60 | Minutes | 2.4.24.1 |
| Z-Axis CTE | A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion) | 55 290 2.8 | ppm/°C ppm/°C % | 2.4.24C |
| X/Y-Axis CTE | Pre-Tg | 12 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.41 | W/mK | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched B. Etched | Pass | Pass Visual | 2.4.13.1 |
| Dk, Permittivity | A. @ 10 GHz B. @ 10 GHz C. @ 10 GHz D. @ 10 GHz | 3.38 3.45 3.60 3.75 | — | 2.5.5.5 |
| Df, Loss Tangent | A. @ 10 GHz B. @ 10 GHz C. @ 10 GHz D. @ 10 GHz | 0.0028 0.0031 0.0035 0.0035 | — | Bereskin Stripline |
| Volume Resistivity | C-96/35/90 | 1.33 x 107 | MΩ-cm | 2.5.17.1 |
| Surface Resistivity | C-96/35/90 | 1.33 x 105 | MΩ | 2.5.17.1 |
| Dielectric Breakdown | 45.4 | kV | 2.5.6B | |
| Arc Resistance | 139 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 45 (1133) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 3 (175-249) | Class (Volts) | UL 746A ASTM D3638 | |
| Peel Strength | 1 oz. EDC foil | 1.0 (5.7) | N/mm (lb/inch) | 2.4.8C |
| Flexural Strength | A. Length direction B. Cross direction | 71.0 58.0 | ksi | 2.4.4B |
| Tensile Strength | A. Length direction B. Cross direction | 39.0 35.0 | ksi | ASTM D3039 |
| Poisson's Ratio | A. Length direction B. Cross direction | 0.234 0.222 | — | ASTM D3039 |
| Moisture Absorption | 0.1 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
| The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold. | ||||
Visit our site https://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected typo for Thermal Conductivity value - 3/18
C: Corrected units for Flexural and Tensile Strength - 8/18
D: Change MOT to RTI 5/19
Core Data
| Thickness (inch) | Thickness (mm) | Dielectric Constant (DK) / Dissipation Factor (DF) | ||||
|---|---|---|---|---|---|---|
| 2 GHz | 5 GHz | 10 GHz | 15 GHz | 20 GHz | ||
| 0.005 | 0.13 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 |
| 0.01 | 0.25 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 |
| 0.02 | 0.51 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 |
| 0.03 | 0.76 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 |
| 0.04 | 1.02 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 |
| 0.06 | 1.52 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 | 3.38 0.0028 |
| 0.005 | 0.13 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 |
| 0.0066 | 0.17 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 |
| 0.01 | 0.25 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 |
| 0.02 | 0.51 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 |
| 0.03 | 0.76 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 |
| 0.06 | 1.52 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 | 3.45 0.0030 |
| 0.005 | 0.13 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 |
| 0.01 | 0.25 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 |
| 0.02 | 0.51 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 | 3.60 0.0032 |
| 0.01 | 0.25 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 |
| 0.0133 | 0.34 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 |
| 0.02 | 0.51 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 |
| 0.03 | 0.76 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 | 3.75 0.0033 |
A - Original
B - Added 20 mil 3.60 Dk and 60 mil 3.45 Dk
Webinars, Videos & Articles
This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.
This presentation discusses the following:
- Printed Circuit Board (PCB)
- Requirements for Operation in mmWave Frequency Band
- Requirements for Automotive Safety Systems
- Available Materials
- Case Study: Automotive RADAR
This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.
This presentation describes the sources & physical mechanisms of PIM in communication systems.
This presentation the sources of Passive Intermodulation in PCBs and how to measure it.
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We thank you for your interest in I-Tera MT40.
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