FR408HR

Lead Free, Mid Loss Laminate and Prepreg

FR408HR is a high-performance FR-4 resin system with a 230°C (DMA) Tg for multilayer PCB applications where maximum thermal performance and reliability are required.

Thermal Performance

Tg: 190°C
Td: 360°C

Electrical Performance

Dk: 3.68
Df: 0.0092

Industry Approvals

IPC-4101 /98 /99 /101 /126
UL - File Number E41625

FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.

The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imagable solder mask imaging.

Attributes

Markets

Product Features

  • Industry Recognition
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • FR-4 process compatible
    • Via filling capability
    • Multiple lamination cycles

Production & Manufacturing

Currently manufactured in Asia, North America, Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 30 mil (0,05 to 0.75 mm)
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
    • Embedded resistor foil
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Heavier copper foil available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 190 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>30
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
230
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 16 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.72
3.69
3.68
3.64
3.65
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0072
0.0091
0.0092
0.0098
0.0095
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
4.4 x 107
9.4 x 107
MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.6 x 106
2.1 x 108
2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 137 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 70 (1741) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-399) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. After process solutions

1.14 (6.5)

0.96 (5.5)
0.90 (5.1)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
500 (72.5)
400 (58.0)
MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
376 (54.5)
267 (38.7)
MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3695
3315
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.137
0.133
ASTM D3039
Moisture Absorption 0.061 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Removed Low Dk Glass Option - 10/18
D: Change MOT to RTI - 5/19
E: Revised CTI to 2 - 1/21

Core Data

Construction Resin Content % Standard/ Alternate Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 Ghz
1x106 72.0% Standard 0.0020 0.051 3.37
0.0075
3.36
0.0089
3.34
0.0096
3.32
0.0101
3.30
0.0107
3.30
0.0107
1x1080 57.0% Standard 0.0025 0.064 3.67
0.0071
3.64
0.0079
3.62
0.0089
3.61
0.0092
3.60
0.0097
3.59
0.0095
1x1067 69.0% Alternate 0.0025 0.064 3.42
0.0075
3.40
0.0084
3.38
0.0095
3.36
0.0100
3.34
0.0105
3.33
0.0104
1x1080 63.0% Standard 0.0030 0.076 3.54
0.0074
3.52
0.0082
3.50
0.0092
3.48
0.0096
3.47
0.0102
3.47
0.0101
1x1086 59.0% Alternate 0.0030 0.076 3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
2x106 67.0% Standard 0.0035 0.089 3.46
0.0074
3.45
0.0083
3.42
0.0094
3.40
0.0098
3.38
0.0104
3.37
0.0102
1x3313 51.0% Standard 0.0035 0.089 3.82
0.0068
3.79
0.0076
3.77
0.0084
3.77
0.0087
3.74
0.0092
3.74
0.0090
1x106/1x1080 59.0% Standard 0.0040 0.102 3.63
0.0072
3.61
0.0080
3.58
0.0090
3.57
0.0093
3.55
0.0098
3.54
0.0096
1x3313 55.0% Standard 0.0040 0.102 3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
1x106/1x1080 61.0% Alternate 0.0043 0.109 3.57
0.0073
3.56
0.0081
3.54
0.0092
3.52
0.0095
3.51
0.0099
3.50
0.0098
1x2116 50.0% Standard 0.0045 0.114 3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
1x106/1x1080 62.0% Standard 0.0045 0.114 3.55
0.0073
3.54
0.0082
3.52
0.0092
3.50
0.0095
3.48
0.0100
3.48
0.0098
2x1067 69.0% Alternate 0.0050 0.127 3.42
0.0075
3.40
0.0084
3.38
0.0095
3.36
0.0100
3.34
0.0105
3.33
0.0104
2x1080 57.0% Standard 0.0050 0.127 3.67
0.0071
3.64
0.0079
3.62
0.0089
3.61
0.0092
3.60
0.0097
3.59
0.0095
1x2116 54.0% Standard 0.0050 0.127 3.72
0.0070
3.71
0.0077
3.70
0.0086
3.69
0.0089
3.67
0.0095
3.67
0.0093
2x1080 58.0% Standard 0.0055 0.140 3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
2x1086 58.0% Alternate 0.0060 0.152 3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
1x1652 50.0% Standard 0.0060 0.152 3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x3313 50.0% Standard 0.0070 0.178 3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x3313 55.0% Standard 0.0080 0.203 3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
2x2116 54.0% Standard 0.0100 0.254 3.72
0.0070
3.71
0.0077
3.70
0.0086
3.69
0.0089
3.67
0.0095
3.67
0.0093
2x1652 42.0% Standard 0.0100 0.254 4.02
0.0065
4.01
0.0072
3.99
0.0080
3.98
0.0083
3.97
0.0088
3.96
0.0085
3x3313 55.0% Standard 0.0120 0.305 3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
1x1080/2x1652 49.0% Standard 0.0140 0.356 3.86
0.0068
3.83
0.0074
3.81
0.0083
3.80
0.0086
3.78
0.0090
3.78
0.0089
3x1652 45.0% Standard 0.0160 0.406 3.95
0.0066
3.92
0.0072
3.91
0.0080
3.90
0.0083
3.89
0.0086
3.88
0.0085
3x1652 50.0% Standard 0.0180 0.457 3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x2116/2x1652 46.0% Alternate 0.0190 0.483 3.92
0.0066
3.90
0.0073
3.89
0.0081
3.87
0.0089
3.86
0.0087
3.85
0.0086
2x2116/2x1652 47.0% Alternate 0.0200 0.508 3.89
0.0067
3.88
0.0074
3.87
0.0083
3.85
0.0085
3.84
0.0089
3.83
0.0088
2x2116/2x1652 50.0% Alternate 0.0210 0.533 3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x2116/3x1652 52.0% Alternate 0.0280 0.711 3.77
0.0073
3.76
0.0080
3.76
0.0088
3.75
0.0091
3.73
0.0093
3.73
0.0093

Prepreg Data

Glass Style Resin Content % Standard/Alternate Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 GHz
106 70.0% Standard 0.0019 0.048 3.40
0.0080
3.38
0.0090
3.36
0.0100
3.34
0.0100
3.32
0.0110
3.31
0.0110
106 75.0% Standard 0.0023 0.058 3.30
0.0080
3.27
0.0090
3.26
0.0100
3.23
0.0110
3.22
0.0110
3.22
0.0110
1067 69.0% Standard 0.0023 0.058 3.42
0.0080
3.40
0.0080
3.38
0.0100
3.36
0.0100
3.34
0.0110
3.33
0.0100
1067 73.0% Standard 0.0027 0.069 3.33
0.0080
3.32
0.0090
3.30
0.0100
3.28
0.0100
3.26
0.0110
3.26
0.0110
1086 62.0% Standard 0.0032 0.081 3.55
0.0070
3.54
0.0080
3.52
0.0090
3.50
0.0100
3.48
0.0100
3.48
0.0100
1080 65.0% Standard 0.0032 0.081 3.50
0.0070
3.49
0.0080
3.46
0.0090
3.44
0.0100
3.42
0.0100
3.42
0.0100
1086 65.0% Standard 0.0035 0.089 3.50
0.0070
3.49
0.0080
3.46
0.0090
3.44
0.0100
3.42
0.0100
3.42
0.0100
1080 71.0% Standard 0.0040 0.102 3.37
0.0080
3.36
0.0090
3.34
0.0100
3.32
0.0100
3.30
0.0110
3.30
0.0110
2313 56.0% Standard 0.0040 0.102 3.70
0.0070
3.67
0.0080
3.65
0.0090
3.64
0.0090
3.63
0.0100
3.62
0.0100
3313 57.0% Standard 0.0040 0.102 3.67
0.0070
3.64
0.0080
3.62
0.0090
3.61
0.0090
3.60
0.0100
3.59
0.0100
2113 57.5% Alternate 0.0041 0.104 3.67
0.0070
3.64
0.0080
3.62
0.0090
3.61
0.0090
3.60
0.0100
3.59
0.0100
3313 59.0% Standard 0.0042 0.107 3.63
0.0070
3.61
0.0080
3.58
0.0090
3.57
0.0090
3.55
0.0100
3.54
0.0100
2116 55.0% Standard 0.0049 0.124 3.72
0.0070
3.70
0.0080
3.68
0.0090
3.66
0.0090
3.65
0.0100
3.65
0.0090
2116 58.0% Alternate 0.0054 0.137 3.65
0.0070
3.63
0.0080
3.60
0.0090
3.59
0.0090
3.57
0.0100
3.56
0.0100

NOTE

Revisions:
A-Original-4/17
B-Added Standard & Alternate construction-8/18
C-Removed Low Dk glass option 10/18

D-1086 71% PP changed to Std/Spread-2/19
E-Corrected RC% on 3 mil 1086 from 58% to 59% 11/22
F-Corrected RC% on 2113 prepreg to 57.5% 2/23
Standard- Available with the best availability.
Alternate-Available with longer lead time

Resources

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

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