This paper presents an experimental, numerical, and analytical investigation of the important role that micro-scale PCB effects play in defining the characteristic impedance of interconnects, the associated attenuation and phase constant, and the appearance of resonances in the insertion and return loss.
This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over
Fire Retardancy What, Why and How (White Paper)
The paper takes a critical look at all aspects of fire retardancy, starting with the need for fire safety.
Utilizing Thermal Fatigue Testing to Differentiate the Performance of Epoxy Materials at Various Glass Transition Temperature Levels (Technical Paper)
This paper discusses Interconnect Stress Testing (IST), an accelerated fatigue test used for evaluating the failure modes of a printed circuit board (PCB) interconnect.
This paper examines the thermal reliability of microvias and standard vias in relation to the materials and processes in which by they are created.
This paper shows how small sets of designed experiments can be used to create a compensation model.
This paper discusses a standard test vehicle design and test method, CAF analysis and board manufacturing.
This paper discusses the electrical characterization of roughness effect for analysis of digital and microwave signal propagation in rough PCB interconnects.
This paper discusses the continuing evolution of FR-4 base materials.
This paper discusses a method to design a thickness prediction model for a specific board shop process.
This paper describes a model that helps predict the dimensional movement as a function of CTE’s and moduli of the constituent layers and as a function of the lamination temperature.
This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.
This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.
This paper discusses how plastic laminates are increasingly used as interposers within chip packaging applications.
This paper describes how micro-sectioning can be an extremely useful technique to inspect PCBs.
This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.
This paper defines a “best practice” methodology to be used in determining selection criteria for lead-free assembly materials.
This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.
This paper discusses the development of resin systems that withstand the higher reflow temperatures required of lead-free solders, while offering ease of fabrication processing and providing cost competitive solutions in today’s global marketplace.
This paper explores several methods used characterize PCB substrate electrical performance.
This paper comparesa the properties of a low Dk, low Df material with an existing low Dk, low Df material in widespread use.
This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.
This paper discusses the challenges and concerns of commercially-available non-halogen materials.
This paper explains the sources of registration error and outlines a path for improving process yield.
This paper provides describes Isola’s work in finding the right combination of process and design conditions for improved CAF resistant products.
This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.
This paper discusses how digital signaling requires interconnects operating at microwave frequencies to achieve current data transfer demands in computing platforms.
This paper will discuss how certain statistical analysis techniques may be used to decipher the results, and predict capabilities of PCB materials and/or processes.
This paper discusses how a relatively easy and repeatable technique is presented for measuring the Dielectric Constant and Dissipation Factor (Dk/Df) of PWB materials for frequencies in the range of 1.5 GHz to 12 GHz.
This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.
This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.
This paper presents the design, implementation and measurement of a high efficient GaN-HEMT power amplifier working at 2.4 GHz.