Tachyon® 100G

Ultra-low loss laminate material

Tachyon 100G laminate materials are designed for very high-speed digital applications up to and beyond data rates of 100 Gb/s.

Tachyon 100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz. These electrical properties provide designers a scalable solution for next generation designs of backplanes and daughter cards, enabling 10x improvements from 10 Gb/s data rates.

Isola has developed Tachyon 100G with the highest level of thermal performance for high layer count line cards. The very low Z-axis CTE makes Tachyon 100G a perfect choice for fine pitch BGA applications of 0.8 mm or less and designs with multiple 2 ounce copper ground planes. Tachyon 100G materials are optimized laminate and prepreg forms that use mechanically spread glass to mitigate skew, improve rise times, reduce jitter, and increase eye width/height and that use ultra smooth VLP2 (2um Rz) copper that significantly reduces conductor losses.

Product Attributes

High Thermal Reliability , High Speed Digital , High Density Interconnect

Typical Market Applications

Aerospace & Defense , Computing, Storage & Peripherals , Networking & Communication Systems

ORDERING INFORMATION:

Contact your local sales representative or visit www.isola-group.com for further information.

Isola Group
3100 West Ray Road
Suite 301
Chandler, AZ 85226
Phone: 480-893-6527
Fax: 480-893-1409
info@isola-group.com

Isola Asia Pacific (Hong Kong) Ltd.
Unit 3512 - 3522, 35/F
No. 1 Hung To Road, Kwun Tong,
Kowloon, Hong Kong
Phone: 852-2418-1318
Fax: 852-2418-1533
info.hkg@isola-group.com

Isola GmbH
Isola Strasse 2
D-52348 Düren, Germany
Phone: 49-2421-8080
Fax: 49-2421-808164
info-dur@isola-group.com

High Thermal Reliability

Data Sheet

Tg 200°C
Td 360°C
Dk 3.02
Df 0.0021

IPC-4103 - / 17
UL - File Number E41625

Last Updated May 16, 2019
Revision No: D

Product Features

  • · Industry Recognition
    • - UL File Number: E41625
    • - RoHS Compliant
  • · Performance Attributes
    • - CAF resistant
    • - Low moisture absorption
    • - 0.8 mm pitch capable
    • - 6x 260°C reflow capable
    • - 6x 288°C solder float capable
  • · Processing Advantages
    • - Multiple lamination cycles
    • - HDI technology compatible

Product Availability

  • ·Standard Material Offering: Laminate
    • -2 to 18 mil (0.05 to 0.46 mm)
  • ·Copper Foil Type
    • -HTE Grade 3
    • -VLP-2 (2 micron), 1 oz and below
    • -RTF (Reverse Treat Foil)
  • ·Copper Weight
    • -½ to 2 oz (18 to 70 µm) available
    • -Thinner copper foil available
  • ·Standard Material Offering: Prepreg
    • -Moisture barrier packaging
  • ·Glass Fabric Availability
    • -Low Dk glass
    • -Square weave glass
    • -Mechanically spread glass
Tachyon® 100G Typical Values
Last Updated May 16, 2019
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Test data generated from rigid laminate 55 % 2.3.16.2
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 220 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 180 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
C. T300
>60
>60
>20
 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
250
2.5
ppm/°C
ppm/°C
%
 2.4.24C
X/Y-Axis CTE Pre-Tg 15 ppm/°C 2.4.24C
Thermal Conductivity 0.42 W/mK ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
3.04
3.02
3.02
 — 2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
 0.0021 — 2.5.5.5
Volume Resistivity C-96/35/90 1.33x107 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33x105 MΩ 2.5.17.1
Dielectric Breakdown 60 kV 2.5.6B
Arc Resistance 125 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 60 (1500) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
0.79 (4.5)

0.96 (5.5)
 N/mm (lb/inch)
2.4.8C

2.4.8.2A
Flexural Strength
A. Length direction
B. Cross direction
44.0
41.0
 ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
30.0
25.0
 ksi ASTM D3039
Test data generated from rigid laminate
A.
B.
C.
D.
2,551
2,417
2,264
2,197
Poisson's Ratio
A. Length direction
B. Cross direction
0.165
0.156
 — ASTM D3039
Moisture Absorption 0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected moisture uptake value 6/18
C: Corrected units for Flexural and Tensile Strength - 8/18
D: Change MOT to RTI - 5/19

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