Very Low-Loss Laminate Material
I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a very low dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.
I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.
RF/Microwave , High Thermal Reliability
Aerospace & Defense , RF / Microwave , Automotive & Transportation , Medical, Industrial & Instrumentation
ORDERING INFORMATION:
Contact your local sales representative or visit www.isola-group.com for further information.
Isola Group
3100 West Ray Road
Suite 301
Chandler, AZ 85226
Phone: 480-893-6527
Fax: 480-893-1409
info@isola-group.com
Isola Asia Pacific (Hong Kong) Ltd.
Unit 3512 - 3522, 35/F
No. 1 Hung To Road, Kwun Tong,
Kowloon, Hong Kong
Phone: 852-2418-1318
Fax: 852-2418-1533
info.hkg@isola-group.com
Isola GmbH
Isola Strasse 2
D-52348 Düren, Germany
Phone: 49-2421-8080
Fax: 49-2421-808164
info-dur@isola-group.com
IPC-4103 - /17
UL - File Number E41625
Property | Typical Value | Units | Test Method | |
---|---|---|---|---|
Metric (English) | IPC-TM-650 (or as noted) | |||
Glass Transition Temperature (Tg) by DSC | 200 | °C | 2.4.25C | |
Glass Transition Temperature (Tg) by TMA | 205 | °C | 2.4.24C | |
Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 | |
Time to Delaminate by TMA (Copper removed) | A. T260 B. T288 |
>60 | Minutes | 2.4.24.1 |
Z-Axis CTE | A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion) |
55 290 2.8 |
ppm/°C ppm/°C % |
2.4.24C |
X/Y-Axis CTE | Pre-Tg | 12 | ppm/°C | 2.4.24C |
Thermal Conductivity | 0.61 | W/mK | ASTM E1952 | |
Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched B. Etched |
Pass | Pass Visual | 2.4.13.1 |
Dk, Permittivity | A. @ 10 GHz B. @ 10 GHz C. @ 10 GHz |
3.38 3.45 3.75 |
— | Bereskin Stripline |
Df, Loss Tangent | A. @ 10 GHz B. @ 10 GHz C. @ 10 GHz |
0.0028 0.0031 0.0035 |
— | Bereskin Stripline |
Volume Resistivity | C-96/35/90 | 1.33 x 107 | MΩ-cm | 2.5.17.1 |
Surface Resistivity | C-96/35/90 | 1.33 x 105 | MΩ | 2.5.17.1 |
Dielectric Breakdown | 45.4 | kV | 2.5.6B | |
Arc Resistance | 139 | Seconds | 2.5.1B | |
Electric Strength (Laminate & laminated prepreg) | 45 (1133) | kV/mm (V/mil) | 2.5.6.2A | |
Comparative Tracking Index (CTI) | 3 (175-249) | Class (Volts) | UL 746A ASTM D3638 |
|
Peel Strength | 1 oz. EDC foil | 1.0 (5.7) |
N/mm (lb/inch) | 2.4.8C |
Flexural Strength | A. Length direction B. Cross direction |
71000 58000 |
ksi | 2.4.4B |
Tensile Strength | A. Length direction B. Cross direction |
39000 35000 |
ksi | ASTM D3039 |
Poisson's Ratio | A. Length direction B. Cross direction |
0.234 0.222 |
— | ASTM D3039 |
Moisture Absorption | 0.1 | % | 2.6.2.1A | |
Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
Max Operating Temperature | 130 | °C | UL 796 | |
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold. |