Astra® MT77

Very Low Loss Laminate and Prepreg Materials

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Thermal PerformanceElectrical PerformanceIndustry Approvals
IPC-4103 - /17
UL - File Number E41625
Astra® MT77 laminates are a breakthrough, very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond.

Astra MT77 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. Astra MT77 is suitable for many of today’s commercial RF/microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C at up to W-band frequencies. In addition, Astra MT77 offers an ultra-low dissipation factor (Df) of 0.0017, making it a cost-effective alternative to PTFE and other commercial microwave laminate materials.

Key applications include long antennas and radar applications for automobiles, such as adaptive cruise control, pre-crash, blind spot detection, lane departure warning and stop and go systems.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • Short lamination cycle
    • Reduced drill wear
    • No plasma desmear required
    • Good flow and fill
    • Dimensional stability
    • Multiple lamination cycles
    • Any layer technology compatible
    • HDI technology compatible
    • VIPPO design compatible

Product Availability

  • Standard Material Offering: Laminate
    • 2.5, 5, 7.5, 10, 12.5, 15, 20, 30, 60 mil ( 0.0635, 0.127, 0.1905, 0.254, 0.3175, 0.381, 0.510, 0.760, 1.50 mm)
  • Copper Foil Type
    • VLP-2 (2 micron), 1 oz and below
  • Copper Weight
    • ⅓, ½, 1 oz (12, 18 and 35 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels

Production & Manufacturing

  • Currently manufactured in North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC200°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
50 - 70
250 - 350
X/Y-Axis CTEPre-Tg12ppm/°C2.4.24C
Thermal Conductivity0.45W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 10 GHz
Df, Loss Tangent
A. @ 2 GHz
B. @ 10 GHz
Volume ResistivityC-96/35/901.33 x 107MΩ-cm2.5.17.1
Surface ResistivityC-96/35/901.33 x 1052.5.17.1
Dielectric Breakdown45.4kV2.5.6B
Arc Resistance139Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength1 oz. EDC foil1.0 (5.7)N/mm (lb/inch)
Flexural Strength
A. Length direction
B. Cross direction
Tensile Strength
A. Length direction
B. Cross direction
ASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
ASTM D3039
Moisture Absorption0.1%
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Webinars, Videos & Articles

PCB Material Selection for RF, Microwave and Millimeter-wave Design (Presentation)

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost (Presentation)

This presentation discusses the following:
- Printed Circuit Board (PCB)
- Requirements for Operation in mmWave Frequency Band
- Requirements for Automotive Safety Systems
- Available Materials
- Case Study: Automotive RADAR

Thermosets' Cost and Reliability Advantages for Automotive Radar PCBs (White Paper)

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Conductive Anodic Filament Growth Failure (Technical Paper)

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction (Presentation)

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

If you have any questions about Astra® MT77, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in Astra® MT77.

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