FR408

High Performance Laminate and Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
180°C
Td
360°C
Dk
3.67
Df
0.0120
IPC-4101 /24 /121 /124
UL - File Number E41625
FR408 is a high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.

Its low dielectric constant (Dk) and low dissipation factor (Df) make it an
ideal candidate for broadband circuit designs requiring faster signal
speeds or improved signal integrity. FR408 is compatible with most
FR-4 processes. This feature allows the use of FR408 without
adding complexity to current fabrication techniques.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

  • Currently manufactured in Asia, North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC180°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
15
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
60
228
3.5
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg13ppm/°C2.4.24C
Thermal Conductivity0.4W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.69
3.66
3.67
3.66
3.65
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0094
0.0117
0.0120
0.0127
0.0125
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
4.6 x 107
2.8 x 108
MΩ-cm2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.81 x 106
2.64 x 108
2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance120Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)55 (1400)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.225 (7.0)
1.14 (6.5)
0.90 (5.1)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
81.4
64.1
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
59.3
42.0
ksiASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3685
3044
ksiASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.162
0.138
ASTM D3039
Moisture Absorption0.15%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
NOTE

Visit our site http://www.isola-group.com for more details.
Revision B: Corrected units for Flexural and Tensile Strength

Core Data

ConstructionResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 Ghz
1x10673.0%0.0020.051
3.36
0.0103
3.32
0.0116
3.31
0.0133
3.29
0.0139
3.27
0.0147
3.26
0.0145
1x108059.0%0.00270.069
3.63
0.0096
3.61
0.0106
3.60
0.012
3.58
0.0124
3.57
0.0131
3.56
0.0129
1x108064.0%0.0030.076
3.52
0.01
3.50
0.011
3.49
0.0124
3.47
0.0129
3.46
0.0137
3.45
0.0135
2x10667.0%0.00350.089
3.46
0.01
3.44
0.0112
3.43
0.0127
3.41
0.0133
3.39
0.014
3.38
0.0138
1x331349.0%0.00350.089
3.86
0.009
3.84
0.0099
3.83
0.011
3.82
0.0114
3.80
0.012
3.80
0.0118
1x331354.0%0.0040.102
3.74
0.0093
3.72
0.0103
3.71
0.0115
3.70
0.0119
3.68
0.0125
3.67
0.0124
2x10670.0%0.0040.102
3.40
0.0101
3.38
0.0114
3.37
0.013
3.35
0.0136
3.33
0.0144
3.32
0.0142
1x307048.0%0.0040.102
3.88
0.009
3.87
0.0098
3.86
0.0109
3.84
0.0113
3.83
0.0119
3.82
0.0117
106/108061.0%0.00430.109
3.58
0.0097
3.56
0.0108
3.55
0.0122
3.54
0.0126
3.52
0.0133
3.51
0.0132
1x211652.0%0.00480.122
3.76
0.0092
3.74
0.0102
3.73
0.0113
3.72
0.0117
3.71
0.0123
3.70
0.0123
2x108057.0%0.0050.127
3.67
0.0095
3.65
0.0105
3.64
0.0118
3.63
0.0122
3.61
0.0129
3.60
0.0127
1x211653.0%0.0050.127
3.76
0.0092
3.74
0.0102
3.73
0.0114
3.72
0.0118
3.71
0.0124
3.70
0.0123
106/211356.0%0.00530.135
3.69
0.0094
3.67
0.0104
3.66
0.0117
3.65
0.0121
3.63
0.0128
3.63
0.0126
1x165246.0%0.00550.14
3.94
0.0089
3.92
0.0097
3.91
0.0108
3.90
0.0111
3.88
0.0116
3.88
0.0125
106/211358.0%0.00550.14
3.65
0.0095
3.63
0.0105
3.62
0.0119
3.60
0.0123
3.59
0.013
3.58
0.0128
1080/211354.0%0.0060.152
3.74
0.0093
3.72
0.0103
3.71
0.0115
3.70
0.0119
3.68
0.0125
3.67
0.0124
1x165250.0%0.0060.152
3.84
0.0091
3.82
0.01
3.81
0.0111
3.79
0.0115
3.78
0.0121
3.77
0.0119
2x108063.0%0.0060.152
3.54
0.0098
3.52
0.0109
3.51
0.0123
3.49
0.0128
3.48
0.0136
3.47
0.0134
2x331354.0%0.0080.203
3.74
0.0093
3.72
0.0103
3.71
0.0115
3.70
0.0119
3.68
0.0125
3.67
0.0124
2x211653.0%0.010.254
3.75
0.0092
3.73
0.0102
3.72
0.0114
3.71
0.0118
3.69
0.0124
3.68
0.0123
1x1080/2x211652.0%0.0120.305
3.76
0.0092
3.74
0.0102
3.73
0.0113
3.72
0.0117
3.71
0.0123
3.70
0.0123
3x211652.0%0.0140.356
3.76
0.0092
3.74
0.0102
3.73
0.0113
3.72
0.0117
3.71
0.0123
3.70
0.0123
2x7628/108042.0%0.0160.406
4.04
0.0087
4.02
0.0094
4.01
0.0104
4.00
0.0107
3.99
0.0112
3.99
0.011
2x7628/211641.0%0.0180.457
4.07
0.0086
4.05
0.0094
4.04
0.0103
4.03
0.0106
4.02
0.0111
4.01
0.0109

Prepreg Data

Glass StyleResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
10675.0%0.00230.058
3.31
0.0104
3.28
0.0117
3.27
0.0135
3.25
0.0141
3.23
0.015
3.23
0.0147
108065.0%0.00310.079
3.50
0.0099
3.48
0.011
3.47
0.0127
3.45
0.0131
3.43
0.0138
3.43
0.0136
108068.0%0.00340.086
3.44
0.01
3.42
0.0112
3.41
0.0128
3.39
0.0134
3.37
0.0141
3.36
0.0139
331353.0%0.00370.094
3.76
0.0092
3.74
0.0102
3.73
0.0114
3.72
0.0118
3.71
0.0124
3.70
0.0123
108071.0%0.00380.097
3.38
0.0102
3.35
0.0115
3.35
0.0131
3.33
0.0137
3.31
0.0145
3.30
0.0143
211357.0%0.0040.102
3.67
0.0095
3.65
0.0105
3.64
0.0118
3.63
0.0122
3.61
0.0129
3.60
0.0127
331359.0%0.00410.104
3.74
0.0096
3.72
0.0106
3.71
0.012
3.70
0.0124
3.68
0.0131
3.67
0.0129
211656.0%0.00510.13
3.69
0.0094
3.67
0.0104
3.66
0.0117
3.65
0.0121
3.63
0.0128
3.63
0.0126
165250.0%0.00580.147
3.84
0.0091
3.82
0.01
3.81
0.0111
3.79
0.0115
3.78
0.0121
3.77
0.0119
762844.0%0.00710.18
3.99
0.0088
3.97
0.0096
3.96
0.0106
3.95
0.011
3.94
0.011
3.93
0.011
NOTE
Please Contact us for more details in below details.
Isola Group 3100 West Ray Road
Suite 301
Chandler, AZ 85226

Phone: 480-893-6527
Phone: 800-537-7656
Fax: 480-893-1409
12/06/2017
03/16/2017
10/17/2012

Webinars, Videos & Articles

New Low Dielectric Constant, High Tg, Printed Circuitry Substrates (Technical Paper)

This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.

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