FR408

High Performance Laminate and Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
180°C
Td
360°C
Dk
3.67
Df
0.0120
IPC-4101 - /24 /121 /124
UL - File Number E41625
FR408 is a high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.

Its low dielectric constant (Dk) and low dissipation factor (Df) make it an
ideal candidate for broadband circuit designs requiring faster signal
speeds or improved signal integrity. FR408 is compatible with most
FR-4 processes. This feature allows the use of FR408 without
adding complexity to current fabrication techniques.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC180°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    60
    15
    Minutes2.4.24.1
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    60
    228
    3.5
    ppm/°C
    ppm/°C
    %
    2.4.24C
    X/Y-Axis CTEPre-Tg13ppm/°C2.4.24C
    Thermal Conductivity0.4W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    3.69
    3.66
    3.67
    3.66
    3.65
    2.5.5.3
    2.5.5.9
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Df, Loss Tangent
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    0.0094
    0.0117
    0.0120
    0.0127
    0.0125
    2.5.5.3
    2.5.5.9
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Volume Resistivity
    A. After moisture resistance
    B. At elevated temperature
    4.6 x 107
    2.8 x 108
    MΩ-cm2.5.17.1
    Surface Resistivity
    A. After moisture resistance
    B. At elevated temperature
    2.81 x 106
    2.64 x 108
    2.5.17.1
    Dielectric Breakdown>50kV2.5.6B
    Arc Resistance120Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)55 (1400)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
    B. Standard profile copper
        1. After thermal stress
        2. At 125ºC (257ºF)
        3. After process solutions

    1.14 (6.5)

    1.225 (7.0)
    1.14 (6.5)
    0.90 (5.1)
    N/mm (lb/inch)
    2.4.8C

    2.4.8.2A
    2.4.8.3
    2.4.8.3
    Flexural Strength
    A. Length direction
    B. Cross direction
    81,400
    64,100
    ksi2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    59,260
    42,040
    ksiASTM D3039
    Poisson's Ratio
    A. Length direction
    B. Cross direction
    0.162
    0.138
    ASTM D3039
    Moisture Absorption0.15%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    03/16/2017
    03/16/2017
    03/15/2017
    02/23/2017
    04/18/2017
    01/10/2014
    10/17/2012

    Webinars, Videos & Articles

    New Low Dielectric Constant, High Tg, Printed Circuitry Substrates (Technical Paper)

    This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.

    If you have any questions about FR408, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

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