Very Low-Loss Laminate Materials

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Thermal PerformanceElectrical PerformanceIndustry Approvals
IPC-4103 - /17
UL - File Number E41625
IS680 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

IS680 is suitable for many of today’s commercial RF/ microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, IS680 offers a very low dissipation factor (Df), making it an extremely cost-effective alternative to PTFE and other commercial microwave laminate materials in double sided applications.

Product Attributes

Typical Market Applications

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages
    • Reduced drill wear
    • No plasma desmear required
    • Consistent dielectric spacing
    • Dimensional stability

Product Availability

  • Standard Material Offering: Laminate
    • 20, 30, 60 mil (0.51, 0.76, 1.5 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available

Production & Manufacturing

  • Currently manufactured in North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC200°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
X/Y-Axis CTEPre-Tg12ppm/°C2.4.24C
Thermal Conductivity0.32W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity@ 10 GHz2.80Bereskin Stripline
Df, Loss Tangent@ 10 GHz0.0025Bereskin Stripline
Dk, Permittivity@ 10 GHz3.00Bereskin Stripline
Df, Loss Tangent@ 10 GHz0.0030Bereskin Stripline
Dk, Permittivity@ 10 GHz3.20Bereskin Stripline
Df, Loss Tangent@ 10 GHz0.0030Bereskin Stripline
Dk, Permittivity@ 10 GHz3.33Bereskin Stripline
Df, Loss Tangent@ 10 GHz0.0030Bereskin Stripline
Dk, Permittivity@ 10 GHz3.38Bereskin Stripline
Df, Loss Tangent@ 10 GHz0.0035Bereskin Stripline
Dk, Permittivity@ 10 GHz3.45Bereskin Stripline
Df, Loss Tangent@ 10 GHz0.0035Bereskin Stripline
Volume ResistivityC-96/35/901.33 x 107MΩ-cm2.5.17.1
Surface ResistivityC-96/35/901.33 x 1052.5.17.1
Dielectric Breakdown45.4kV2.5.6B
Arc Resistance139Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)
Comparative Tracking Index (CTI)2Class (Volts)UL 746A
ASTM D3638
Peel Strength1 oz. EDC foil0.70 (4.01)N/mm (lb/inch)
Flexural Strength
A. Length direction
B. Cross direction
Tensile Strength
A. Length direction
B. Cross direction
ASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
ASTM D3039
Moisture Absorption0.10%
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature110°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Webinars, Videos & Articles

PCB Material Selection for RF, Microwave and Millimeter-wave Design (Presentation)

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This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

If you have any questions about IS680, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in IS680.

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