Tachyon® 100G

Ultra Low Loss Laminate Material

Thermal PerformanceElectrical PerformanceIndustry Approvals
IPC-4103 - /17
UL - File Number E41625
Tachyon 100G laminate materials are designed for very high-speed digital applications up to and beyond data rates of 100 Gb/s.

Tachyon 100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz. 

Tachyon 100G has a nominal dielectric constant (Dk) of 3.02 and a very low nominal dissipation factor (Df) of 0.0021. These electrical properties provide designers a scalable solution for next generation designs of new backplanes and daughter cards, enabling 10x improvements from 10 Gb/s data rates. 

Isola has developed Tachyon 100G with the highest level of thermal performance for high layer count line cards. The very low Z-axis CTE makes Tachyon 100G a perfect choice for fine pitch BGA applications of 0.8 mm or less and designs with multiple 2 ounce copper ground planes.

Isola offers Tachyon 100G materials in optimized laminate and prepreg forms that use mechanically spread glass to mitigate skew, improve rise times, reduce jitter, and increase eye width/height and that use ultra smooth VLP copper that significantly reduces conductor losses.

Tachyon 100G is offered with thicknesses from 2 to 18 mils and standard panel sizes to provide a complete material solution for high-speed digital, multi-layer backplanes and daughter cards.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Low moisture absorption
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • Multiple lamination cycles
    • HDI technology compatible

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HTE Grade 3
    • VLP-2 (2 micron), 1 oz and below
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Moisture barrier packaging
  • Glass Fabric Availability
    • Low Dk glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

  • Currently manufactured in Asia, North America
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Test data generated from rigid laminateResin Content55%
Glass Transition Temperature (Tg) by DSC185°C2.4.25C
Glass Transition Temperature (Tg) by DMA220°C2.4.24.4
Glass Transition Temperature (Tg) by TMA180°C2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
C. T300
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
X/Y-Axis CTEPre-Tg15ppm/°C2.4.24C
Thermal Conductivity0.42W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
Volume ResistivityC-96/35/901.33x107MΩ-cm2.5.17.1
Surface ResistivityC-96/35/901.33x1052.5.17.1
Dielectric Breakdown60kV2.5.6B
Arc Resistance125Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)60 (1500)kV/mm (V/mil)
Comparative Tracking Index (CTI)3Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
0.79 (4.5)

0.96 (5.5)
N/mm (lb/inch)
Flexural Strength
A. Length direction
B. Cross direction
Tensile Strength
A. Length direction
B. Cross direction
ksiASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
ksiASTM D790-15e2
Taylor's Modulus
A. Length direction
B. Cross direction
ksiASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
ASTM D3039
Moisture Absorption0.05%
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Webinars, Videos & Articles

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions (Technical Paper)

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model (Presentation)

This presentation outlines practical fiber weave effect model for skew and jitter.

PCB Material Selection for High-speed Digital Designs (Presentation)

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

If you have any questions about Tachyon 100G, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in Tachyon 100G.

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