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Products > FR408

FR408 Tg 180, Td 360
Dk 3.67, Df 0.0120
/24 /121 /124

FR408 is a high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.

Its low dielectric constant (Dk) and low dissipation factor (Df) make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques.

Key Features

Industry Approvals

  • IPC-4101C  /24 /121 /124
  • UL Recognized – FR-4, File Number E41625
  • Qualified to UL’s MCIL Program

High Thermal Performance

  • Tg of 180°C (DSC)
  • Td of 360°C (@ 5% weight loss)

Improved Dielectric Properties

  • Dk <3.67      2 to 10 GHz  >42% resin content
  • Df <0.0125    2 to 10 GHz  >42% resin content

UV Blocking and AOI Fluorescence

  • High throughput and accuracy during PCB fabrication and assembly

Superior Processing

  • Closest to conventional FR-4 processing of all high speed materials

Standard Availability

  • Thickness: 0.002″ [.05 mm] to 0.093″ [2.4 mm]
    Available in sheet or panel form
  • Copper Foil Cladding: Grade 3 (HTE), ½, 1 and 2 oz.
    Heavy foils available on request
  • Foil Options: Reverse treat
  • Prepregs: Available in roll or panel form
  • Glass Styles:106, 1080, 1652, 2113, 2116, 3070, 3313, 7628