Products > P95/P25

P95/P25 Tg 260, Td 416
Dk 3.76, Df 0.0170
/40 /41 /42

Isola offers a product line of polyimide-based prepreg (P25) and core material (P95) for high temperature printed circuit applications.

These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Key Features

Industry Approvals

  • IPC-4101D-WAM1 /41/40/42
  • UL Recognized – GPY, File NumberE41625

High Tg – 260°C (TMA)

  • Greater thermal performance over epoxy-bismaleimide blends

Maintains Bond Strength at High Temperature

Tough Resin System

  • Improved processing due to less brittleness
  • Less delamination from machining

Non-brominated Chemistry, Thermally Stable Laminate System

  • Full benefits of 100% polyimide performance

Non-MDA (Methylenedianiline) Chemistry

  • Meets all OSHA 1910.1050 requirements

Standard Availability

  • Thickness: 0.0025″ [0.05 mm] to 0.125″ [3.2 mm]
    Available in sheet or panel form
  • Copper Foil Cladding: Grade 3 (HTE), 1⁄2, 1 and 2 oz.
  • Foil Options: Double treat
  •  Prepregs: Available in roll or panel form
  • Glass Styles: 106, 1080, 2113, 2116, and 7628