P96
Tg 260, Td 416
Dk 3.76, Df 0.017
/40 /41 /42
Isola Group offers a P96 product line of polyimide-based prepreg and copper clad laminates for high temperature printed circuit applications.
These products consist of a flame resistant, polyimide‑resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Key Features
Industry Approvals
- IPC-4101C /41 /40/42
- UL Recognized – GPY, File NumberE41625
High Tg – 260°C (TMA)
- Greater thermal performance over epoxy-bismaleimide Blends
Maintains Bond Strength at High Temperature
Tough Resin System
- Improved processing due to less brittleness
- Less delamination from machining
Brominated Chemistry, Thermally Stable Laminate System
- Full benefits of 100% polyimide performance
Non-MDA (Methylenedianiline) Chemistry
- Meets all OSHA 1910.1050 requirements
Standard Availability
- Thickness: 0.0025″ [.05 mm] to 0.125″ [3.2 mm]
Available in sheet or panel form - Copper Foil Cladding: Grade 3 (HTE), 1⁄2, 1 and 2 oz.
- Foil Options: Double treat
- Prepregs: Available in roll or panel form
- Glass Styles: Most standard fabrics
