DE104

Low Tg Laminate and Prepreg

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Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
135°C
Td
315°C
Dk
4.37
Df
0.022
IPC-4101 /21
UL - File Number E41625
DE104 offers excellent thermal resistance, due to its special resin system and a low coefficient of thermal expansion in the Z-axis.

The glass transition temperature (Tg) is 135°C (DSC). Time to delamination of the laminate at a temperature of 260°C is 12 minutes and the decomposition temperature (Td) is 315°C. The product is listed as FR-4 and can be processed using standard parameters. DE104 multilayer (ML) corresponds to NEMA-grade FR-4 and meets the requirements of IPC-4101D WAM1.

Product Attributes

Typical Market Applications

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

  • Currently manufactured in Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC135°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss315°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
12
°C
Minutes
2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
70
250
4.2
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg16/13ppm/°C2.4.24C
Thermal Conductivity0.36W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
4.46
4.40
4.37
4.35
4.32
2.5.5.3
2.5.5.3
2.5.5.9
2.5.5.5
2.5.5.5
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
0.020
0.021
0.022
0.023
2.5.5.3
2.5.5.3
2.5.5.9
2.5.5.5
Dk, Permittivity@ 5 GHz0.0242.5.5.5
Volume Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
1.3 x 106
3.4 x 107
MΩ-cm2.5.17.1
Surface Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
1.0 x 106
7.2 x 106
2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance105Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)2Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.23 (7.0)

1.58 (9.0)
1.23 (7.0)
1.58 (9.0)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
84,000
65,200
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
57,000
42,400
ksiASTM D3039
Moisture Absorption0.3%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
03/16/2017
10/02/2014
10/16/2012

Webinars, Videos & Articles

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

If you have any questions about DE104, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

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