DE104

Low Tg Laminate and Prepreg

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Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
135°C
Td
315°C
Dk
4.37
Df
0.022
IPC-4101 - /21
UL - File Number E41625
DE104 offers excellent thermal resistance, due to its special resin system and a low coefficient of thermal expansion in the Z-axis.

The glass transition temperature (Tg) is 135°C (DSC). Time to delamination of the laminate at a temperature of 260°C is 12 minutes and the decomposition temperature (Td) is 315°C. The product is listed as FR-4 and can be processed using standard parameters. DE104 multilayer (ML) corresponds to NEMA-grade FR-4 and meets the requirements of IPC-4101D WAM1.

Product Attributes

Typical Market Applications

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC135°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss315°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    12
    °C
    Minutes
    2.4.24.1
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    70
    250
    4.2
    ppm/°C
    ppm/°C
    %
    2.4.24C
    X/Y-Axis CTEPre-Tg16/13ppm/°C2.4.24C
    Thermal Conductivity0.36W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 100 MHz
    B. @ 500 MHz
    C. @ 1 GHz
    D. @ 2 GHz
    E. @ 5 GHz
    4.46
    4.40
    4.37
    4.35
    4.32
    2.5.5.3
    2.5.5.3
    2.5.5.9
    2.5.5.5
    2.5.5.5
    Df, Loss Tangent
    A. @ 100 MHz
    B. @ 500 MHz
    C. @ 1 GHz
    D. @ 2 GHz
    0.020
    0.021
    0.022
    0.023
    2.5.5.3
    2.5.5.3
    2.5.5.9
    2.5.5.5
    Dk, Permittivity@ 5 GHz0.0242.5.5.5
    Volume Resistivity
    A. C-96/35/90
    B. After moisture resistance
    C. At elevated temperature
    1.3 x 106
    3.4 x 107
    MΩ-cm2.5.17.1
    Surface Resistivity
    A. C-96/35/90
    B. After moisture resistance
    C. At elevated temperature
    1.0 x 106
    7.2 x 106
    2.5.17.1
    Dielectric Breakdown>50kV2.5.6B
    Arc Resistance105Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)2Class (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
    B. Standard profile copper
        1. After thermal stress
        2. At 125ºC (257ºF)
        3. After process solutions

    1.23 (7.0)

    1.58 (9.0)
    1.23 (7.0)
    1.58 (9.0)
    N/mm (lb/inch)
    2.4.8C

    2.4.8.2A
    2.4.8.3
    2.4.8.3
    Flexural Strength
    A. Length direction
    B. Cross direction
    84,000
    65,200
    ksi2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    57,000
    42,400
    ksiASTM D3039
    Moisture Absorption0.3%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    03/16/2017
    04/18/2017
    10/02/2014
    10/16/2012

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    Laminate & Prepreg Manufacturing (Presentation)

    This presentation describes the process of laminate and prepreg manufacturing.

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