Automotive & Transportation

Reliability is a key driver for PCB designers in the automotive and transportation industries. Isola has developed materials engineers require to provide superior thermal endurance, both with respect to operating temperature and thermal cycling performance, achieved with patented filler technology, meeting or exceeding the most demanding customer requirements.

The need for advanced automotive & transportation safety and driver assistance systems such as collision avoidance and emergency braking, blind spot detection and lane departure warning are increasing with both regulatory mandates and consumer demand for improved safety. Isola has been successful in developing extremely cost-effective alternatives to PTFE and other commercial microwave laminate materials in order to engage with the mass-market deployment of these systems.

Additionally, Isola offers certified laminate systems according to standards set forth by the International Union of Railways and its member organizations.

Isola’s 370HR, 185HR, DE104, IS400 and FR408HR are certified according to the European Standard EN 45545-2:2015 and comply with the requirements for the Hazard Levels HL1 – HL2 – HL3 requirements set R24 and R25.

IS400 is also certified according to NFPA 130:2017

IS550H
Tg: 200°C
Td: 400°C
Dk: 4.43
Df: 0.016
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TerraGreen® (RF/MW)
Tg: 200°C
Td: 390°C
Dk: 3.45
Df: 0.0032
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I-Tera® MT40 (RF/MW)
Tg: 200°C
Td: 360°C
Dk: 3.38 / 3.45 / 3.60 / 3.75
Df: 0.0028 - 0.0035
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370HR
Tg: 180°C
Td: 340°C
Dk: 4.04
Df: 0.0210
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I-Tera® MT40
Tg: 200°C
Td: 360°C
Dk: 3.45
Df: 0.0031
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P95/P25
Tg: 260°C
Td: 416°C
Dk: 3.76
Df: 0.017
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IS410
Tg: 180°C
Td: 350°C
Dk: 3.97
Df: 0.0200
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IS400
Tg: 150°C
Td: 330°C
Dk: 3.90
Df: 0.022
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ED130UV
Tg: 135°C
Dk: 4.35
Df: 0.017
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DE104
Tg: 135°C
Td: 315°C
Dk: 4.37
Df: 0.022
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Astra® MT77
Tg: 200°C
Td: 360°C
Dk: 3.00
Df: 0.0017
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185HR
Tg: 180°C
Td: 340°C
Dk: 4.01
Df: 0.0200
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Resources

Laminate Materials with Low Dielectric Properties

This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

Conductive Anodic Filament Growth Failure

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

Coated Copper Foils for High Density Interconnects

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Thermal Management of PCBs in Embedded Systems

This presentation discusses thermal management considerations for embedded systems.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

PCB Material Selection for RF, Microwave and Millimeter-wave Design

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost

This presentation discusses the following: - Printed Circuit Board (PCB) - Requirements for Operation in mmWave Frequency Band - Requirements for Automotive Safety Systems - Available Materials - Case Study: Automotive RADAR

Material & Process Influences on Conductive Anodic Filamentation (CAF)

This presentation describes how Bell Laboratories investigated the mechanism of CAF formation.

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

New Thermoset PCB Material Emerging for mmWave Applications

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

Detroit vs. Silicon Valley: What’s Driving the Proliferation of Automotive Electronics?

This article discusses how technology is changing the automotive industry.

CAF Resistance of NON-DICY FR-4

This article discusses how non-dicyandiamide FR-4 stacks up under Telecordia GR-78 insulation and degradation tests.

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

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