TerraGreen® 400G

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G laminate materials are our most advanced ultra high speed, halogen free ultra low loss design solution.

Thermal Performance

Tg: 200°C
Td: 380°C

Electrical Performance

Dk: 3.15
Df: 0.0017

Industry Approvals

IPC-4101 /134
UL - File Number E41625

TerraGreen® 400G is our Halogen Free material solution for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications and AI applications. Our novel resin system, ultra smooth HVLP3(VLP1) copper foil and Low Dk glass has been engineered for very high data rates of >100 Gb/s with excellent cost for loss performance.

The TerraGreen® 400G resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems excellent interlaminar and bond line adhesion strength.

TerraGreen® 400G is lead free compatible and sequential lamination capable and can be processed utilizing standard PCB equipment and processing steps. TerraGreen® 400G meets UL94 V-0.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Low moisture absorption
    • Halogen free
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • FR-4 process compatible
    • Excellent Fill and Flow
    • Multiple lamination cycles
    • HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HVLP3 (VLP1) ≤1.1 micron Rz JIS
    • RTF3 ≤2.5 micron Rz JIS
  • Copper Weight
    • ⅓, ½, 1 oz (12, 18 and 35 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • Low Dk glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 215 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 180 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss >380C °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T288
B. T300
60+ Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
37
170
1.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE 12/13 ppm/°C 2.4.24C
Thermal Conductivity 0.54 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 10 GHz
B. @ 20 GHz
3.15
3.13
2.5.5.5
Df, Loss Tangent
A. @ 10 GHz
B. @ 20 GHz
0.0017 2.5.5.5
Volume Resistivity C-96/35/90 2.0x108 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 2.0x107 2.5.17.1
Dielectric Breakdown 70 kV 2.5.6B
Arc Resistance 180 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 67(1700) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-499) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile and very low profile copper foil
B. Low profile and very low profile copper foil ... After thermal stress
0.7 (4.1) N/mm (lb/inch)
2.4.8C

2.4.8.2A
Flexural Strength
A. Length direction
B. Cross direction
393 (57)
338 (49)
MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
220 (32)
193 (28)
MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
14.5 (2100)
13.0 (1900)
GPa(kpsi) ASTM D790-15e2
Flexural Modulus
A. Lengthwise
B. Crosswise
12.1 (1750)
11.7 (1700)
GPa (kpsi) ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.17
0.22
ASTM D3039
Moisture Absorption <0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 140 °C UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Notes:
All data is preliminary and subject to change
* Data was developed using 55% RC rigid laminate

Revisions:
A: Preliminary Release<1/23
B: Corrected Flexural Strength from 33 to 338 and units for Youngs Modulus from MPa to GPa - 1/24

Core Data

Construction Resin Content % Offering Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
10 GHz 15 Ghz 20 Ghz 30 Ghz 30 Ghz D
1x1035 65.0% Standard 0.0020 0.051 3.18
0.0017
3.17
0.0017
3.16
0.0017
3.15
0.0017
2.95
0.0017
1x1035 72.0% Standard 0.0025 0.064 3.11
0.0017
3.10
0.0017
3.09
0.0017
3.08
0.0017
2.88
0.0017
1x1078 65.0% Standard 0.0030 0.076 3.18
0.0017
3.17
0.0017
3.16
0.0017
3.15
0.0017
2.95
0.0017
1x1027/1x1035 67.0% Alternate 0.0035 0.089 3.16
0.0017
3.15
0.0017
3.14
0.0017
3.13
0.0017
2.93
0.0017
1x1078 69.0% Standard 0.0035 0.089 3.14
0.0017
3.13
0.0017
3.12
0.0017
3.11
0.0017
2.91
0.0017
1x3313 57.0% Standard 0.0040 0.102 3.26
0.0018
3.25
0.0018
3.24
0.0018
3.23
0.0018
3.03
0.0018
2x1035 65.0% Standard 0.0040 0.102 3.18
0.0017
3.17
0.0017
3.16
0.0017
3.15
0.0017
2.95
0.0017
1x1035/1x1067 65.0% Alternate 0.0040 0.102 3.18
0.0017
3.17
0.0017
3.16
0.0017
3.15
0.0017
2.95
0.0017
1x1078 72.5% Standard 0.0040 0.102 3.11
0.0017
3.10
0.0017
3.09
0.0017
3.08
0.0017
2.88
0.0017
1x3313 60.5% Standard 0.0045 0.114 3.22
0.0018
3.21
0.0018
3.20
0.0018
3.19
0.0018
2.99
0.0018
2x1035 69.0% Standard 0.0045 0.114 3.14
0.0017
3.13
0.0017
3.12
0.0017
3.11
0.0017
2.91
0.0017
1x1035/1x1067 69.0% Alternate 0.0045 0.114 3.14
0.0017
3.13
0.0017
3.12
0.0017
3.11
0.0017
2.91
0.0017
1x3313 64.5% Standard 0.0050 0.127 3.18
0.0017
3.17
0.0017
3.16
0.0017
3.15
0.0017
2.95
0.0017
2x1035 72.0% Standard 0.0050 0.127 3.11
0.0017
3.10
0.0017
3.09
0.0017
3.08
0.0017
2.88
0.0017
1x1035/1x1067 72.0% Alternate 0.0050 0.127 3.11
0.0017
3.10
0.0017
3.09
0.0017
3.08
0.0017
2.88
0.0017
2x1078 65.0% Standard 0.0060 0.152 3.18
0.0017
3.17
0.0017
3.16
0.0017
3.15
0.0017
2.95
0.0017
2x1078 69.0% Standard 0.0070 0.178 3.14
0.0017
3.13
0.0017
3.12
0.0017
3.11
0.0017
2.91
0.0017
2x3313 57.0% Standard 0.0080 0.203 3.26
0.0018
3.25
0.0018
3.24
0.0018
3.23
0.0018
3.03
0.0018
3x1078 67.8% Standard 0.0100 0.254 3.17
0.0017
3.16
0.0017
3.15
0.0017
3.14
0.0017
2.94
0.0017

Prepreg Data

Glass Resin Content % Offering Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
10 GHz 15 GHz 20 GHz 30 GHz
1035 65.0% Standard 0.0020 0.051 3.18
0.0017
3.18
0.0017
3.18
0.0017
3.18
0.0017
1035 72.0% Standard 0.0025 0.064 3.11
0.0017
3.11
0.0017
3.11
0.0017
3.11
0.0017
1035 76.5% Standard 0.0030 0.076 3.08
0.0017
3.08
0.0017
3.08
0.0017
3.08
0.0017
1078 69.0% Standard 0.0035 0.089 3.14
0.0017
3.14
0.0017
3.14
0.0017
3.14
0.0017
1078 72.5% Standard 0.0040 0.102 3.11
0.0017
3.11
0.0017
3.11
0.0017
3.11
0.0017
1078 74.0% Standard 0.0043 0.109 3.10
0.0017
3.10
0.0017
3.10
0.0017
3.10
0.0017
3313 60.5% Standard 0.0045 0.114 3.22
0.0018
3.22
0.0018
3.22
0.0018
3.22
0.0018
3313 64.5% Standard 0.0051 0.130 3.18
0.0017
3.18
0.0017
3.18
0.0017
3.18
0.0017
3313 67.5% Standard 0.0056 0.142 3.15
0.0017
3.15
0.0017
3.15
0.0017
3.15
0.0017
2116 60.5% Standard 0.0058 0.147 3.22
0.0018
3.22
0.0018
3.22
0.0018
3.22
0.0018
2116 63.5% Standard 0.0064 0.163 3.19
0.0017
3.19
0.0017
3.19
0.0017
3.19
0.0017

NOTE

Revisions:
A-Original-3/23
B-Adjusted RC%, Dk and Df values to match test data -7/23
All TerraGreen 400G glass is Spread Weave in both directions
Standard-Commonly available
Alternate-Available, but not stocked
30 GHz D are extracted closely coupled differential values

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Laminates, Prepreg, & PCB Materials

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