Networking & Communication Systems

As bandwidth becomes a more pressing issue in networking & communication systems PCB materials play an increasingly critical component. OEMs serving these markets turn to Isola for its high performance requirements and reliability of laminates that meet the highest quality demands for video, voice and satellite services and other data-intensive applications where bandwidth is an issue. Isola partners with leaders across these varied markets where manufacturers of high-speed network equipment, satellite transmission systems, mobile computing and wireless networks must adhere to extremely stringent internal procedures and standardized test vehicles for qualifying laminates. Isola materials are engineered for the most demanding environments and systems.

Tachyon® 100G
Tg: 200°C
Td: 360°C
Dk: 3.02
Df: 0.0021
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185HR
Tg: 180°C
Td: 340°C
Dk: 4.01
Df: 0.020
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FR408HR
Tg: 190°C
Td: 360°C
Dk: 3.68
Df: 0.0092
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TerraGreen®
Tg: 200°C
Td: 390°C
Dk: 3.44
Df: 0.0039
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I-Tera® MT40
Tg: 200°C
Td: 360°C
Dk: 3.45
Df: 0.0031
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I-Speed®
Tg: 180°C
Td: 360°C
Dk: 3.64
Df: 0.0060
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FR408
Tg: 180°C
Td: 360°C
Dk: 3.67
Df: 0.0120
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370HR
Tg: 180°C
Td: 340°C
Dk: 4.04
Df: 0.021
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IS410
Tg: 180°C
Td: 350°C
Dk: 3.97
Df: 0.0200
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Resources

PCB Material Selection for RF, Microwave and Millimeter-wave Design

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

Thermal Management of PCBs in Embedded Systems

This presentation discusses thermal management considerations for embedded systems.

PIM in PCBs: Mechanisms & Mitigation

This presentation describes the sources & physical mechanisms of PIM in communication systems.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

New Thermoset PCB Material Emerging for mmWave Applications

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

Signal Integrity Considerations in High-Reliability Designs

This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.

CAF Resistance of NON-DICY FR-4

This article discusses how non-dicyandiamide FR-4 stacks up under Telecordia GR-78 insulation and degradation tests.

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

PCB-Substrate Characterization at Multigigahertz Frequencies Through SIW Measurements

This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.

Laminate Materials with Low Dielectric Properties

This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

Conductive Anodic Filament Growth Failure

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

Coated Copper Foils for High Density Interconnects

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability

This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.

Re-engineered FR-4 Base Materials for Improved Multilayer PCB Performance

This paper discusses the continuing evolution of FR-4 base materials.

New Low Dielectric Constant, High Tg, Printed Circuitry Substrates

This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.

Sequential Lamination in Printed Circuit Boards

This application note addresses the mechanical issues of this technology, when it is used on thicker boards.

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