High Speed Digital

Isola offers a wide range of High-speed Digital (HSD) materials that deliver superior performance and CAF resistance. These low-loss materials are targeted for applications that require high reliability and signal integrity. Isola also offers halogen-free HSD materials for green electronics.

A successful high-speed digital product is reliant upon the PCB material selected. Several factors, such as the maximum data rate, the length of the high-speed digital channel, as well as thermal and processing considerations should be taken into account when choosing a material.



  • Excellent Conductive Anodic Filament (CAF) performance
  • Superior thermal robustness
  • Lead-free assembly

Typical Applications

  • Automotive
  • Communications and networking servers
  • Wireless handsets and infrastructure
  • Internet infrastructure
  • Test & measurement
  • Backplanes


Related Materials From Isola

TerraGreen® 400G2
Tg: 200°C
Td: 380°C
Dk: 3.10
Df: 0.0015
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TerraGreen® 400GE
Tg: 200°C
Td: 380°C
Dk: 3.29
Df: 0.0026
View Details
Tg: 205°C
Td: 385°C
Dk: 3.80
Df: 0.006
View Details
TerraGreen® 400G
Tg: 200°C
Td: 380°C
Dk: 3.15
Df: 0.0017
View Details
Tachyon® 100G
Tg: 215°C
Td: 360°C
Dk: 3.02
Df: 0.0021
View Details
I-Tera® MT40
Tg: 215°C
Td: 360°C
Dk: 3.45
Df: 0.0031
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Tg: 180°C
Td: 360°C
Dk: 3.63
Df: 0.0060
View Details
Tg: 190°C
Td: 360°C
Dk: 3.68
Df: 0.0092
View Details


Stack-up and routing optimization by understanding micro-scale PCB effects

This paper presents an experimental, numerical, and analytical investigation of the important role that micro-scale PCB effects play in defining the characteristic impedance of interconnects, the associated attenuation and phase constant, and the appearance of resonances in the insertion and return loss.

New Developments in High Frequency Dielectric Measurements of PWB Materials Part II: Applications of the Bereskin Method to PWB Materials

This paper discusses how a relatively easy and repeatable technique is presented for measuring the Dielectric Constant and Dissipation Factor (Dk/Df) of PWB materials for frequencies in the range of 1.5 GHz to 12 GHz.

Making Sense of Laminate Dielectric Properties

This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

Laminate Materials with Low Dielectric Properties

This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

Coated Copper Foils for High Density Interconnects

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

Thermal Management of PCBs in Embedded Systems

This presentation discusses thermal management considerations for embedded systems.

SITV’s Stack-ups and Loss

This presentation outlines SITV stack-ups general, loss characterization and balancing resin content.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost

This presentation discusses the following: - Printed Circuit Board (PCB) - Requirements for Operation in mmWave Frequency Band - Requirements for Automotive Safety Systems - Available Materials - Case Study: Automotive RADAR

Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model

This presentation outlines practical fiber weave effect model for skew and jitter.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Detroit vs. Silicon Valley: What’s Driving the Proliferation of Automotive Electronics?

This article discusses how technology is changing the automotive industry.

Signal Integrity Considerations in High-Reliability Designs

This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.

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