Computing, Storage & Peripherals

Wikipedia defines “The Internet of Things” or IoT. as “the interconnection of uniquely identifiable embedded computing like devices within the existing internet infrastructure.” The increased demand for connected and smart devices requires additional bandwidth for ease of data transmission and accessibility. Isola has engineered its high-speed digital materials to support the foundation of the IoT. Isola laminates provide for ease in processing, stable electrical properties (Dk and Df) and thermal reliability.

Isola Features

  • Multiple resin systems:  High Tg, lead free, high speed digital, RF, halogen free
  • Standard glass styles
  • Square weave and spread glass
  • Sequential lamination
  • Hybrid processing

Typical Applications

  • Internet infrastructure
  • Servers
  • Edge routers
  • Core routers
  • Backplanes
Tachyon® 100G
Tg: 200°C
Td: 360°C
Dk: 3.02
Df: 0.0021
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FR408HR
Tg: 190°C
Td: 360°C
Dk: 3.68
Df: 0.0092
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I-Speed®
Tg: 180°C
Td: 360°C
Dk: 3.64
Df: 0.0060
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TerraGreen®
Tg: 200°C
Td: 390°C
Dk: 3.44
Df: 0.0039
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I-Tera® MT40
Tg: 200°C
Td: 360°C
Dk: 3.45
Df: 0.0031
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370HR
Tg: 180°C
Td: 340°C
Dk: 4.04
Df: 0.0210
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FR408
Tg: 180°C
Td: 360°C
Dk: 3.67
Df: 0.0120
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IS415
Tg: 200°C
Td: 370°C
Dk: 3.72
Df: 0.0120
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Resources

Moisture Absorption Properties of Laminates Used in Chip Packaging Applications

This paper discusses how plastic laminates are increasingly used as interposers within chip packaging applications.

Conductive Anodic Filament Growth Failure

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability

This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.

New Low Dielectric Constant, High Tg, Printed Circuitry Substrates

This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.

Coated Copper Foils for High Density Interconnects

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Signal Integrity Considerations in High-Reliability Designs

This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.

CAF Resistance of NON-DICY FR-4

This article discusses how non-dicyandiamide FR-4 stacks up under Telecordia GR-78 insulation and degradation tests.

Thermal Management of PCBs in Embedded Systems

This presentation discusses thermal management considerations for embedded systems.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

Meeting Flame Resistance Requirements for Green Electronics

This presentation discusses challenges and opportunities for halogen-free laminates.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

Sequential Lamination in Printed Circuit Boards

This application note addresses the mechanical issues of this technology, when it is used on thicker boards.

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