High Thermal Reliability

Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.

 

While excellent thermal reliability through assembly has always been important, the advent of lead-free assembly has required further enhancements to printed circuit materials in recent years due to the higher assembly temperatures required. In addition, many products that have had exemptions for lead-free assembly will need to convert to lead-free assembly in the near future. Often, these are the more complex PCB designs where thermal requirements are already demanding.

Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Isola offers several products with different levels of electrical performance that all possess excellent thermal reliability.

Features

Overview

  • High glass transition temperature, Tg
  • Low CTE
  • High decomposition temperature, Td
  • Low moisture absorption
  • High time to delamination, T-260 & T-288
  • Ease of manufacturing
  • Global availability & technical support

Typical Applications

  • Lead-free assembly
  • Sequential lamination
  • Automotive
  • Aerospace
  • Military
  • Down-well drilling
  • Telecommunications & Network Infrastructure
  • High-speed computing

Markets

Related Materials From Isola

IS550H
Tg: 200°C
Td: 400°C
Dk: 4.43
Df: 0.016
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IS400HR
Tg: 150°C
Td: 330°C
Dk: 4.20
Df: 0.016
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TerraGreen® (RF/MW)
Tg: 200°C
Td: 390°C
Dk: 3.45
Df: 0.0032
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I-Tera® MT40 (RF/MW)
Tg: 200°C
Td: 360°C
Dk: 3.38 / 3.45 / 3.60 / 3.75
Df: 0.0028 - 0.0035
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Astra® MT77
Tg: 200°C
Td: 360°C
Dk: 3.00
Df: 0.0017
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185HR
Tg: 180°C
Td: 340°C
Dk: 4.01
Df: 0.0200
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Tachyon® 100G
Tg: 200°C
Td: 360°C
Dk: 3.02
Df: 0.0021
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TerraGreen®
Tg: 200°C
Td: 390°C
Dk: 3.44
Df: 0.0039
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I-Tera® MT40
Tg: 200°C
Td: 360°C
Dk: 3.45
Df: 0.0031
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I-Speed®
Tg: 180°C
Td: 360°C
Dk: 3.64
Df: 0.0060
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FR408HR
Tg: 190°C
Td: 360°C
Dk: 3.68
Df: 0.0092
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IS415
Tg: 200°C
Td: 370°C
Dk: 3.72
Df: 0.0120
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370HR
Tg: 180°C
Td: 340°C
Dk: 4.04
Df: 0.0210
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IS400
Tg: 150°C
Td: 330°C
Dk: 3.90
Df: 0.022
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IS420
Tg: 170°C
Td: 350°C
Dk: 4.04
Df: 0.021
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P96/P26
Tg: 260°C
Td: 396°C
Dk: 3.76
Df: 0.017
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P95/P25
Tg: 260°C
Td: 416°C
Dk: 3.76
Df: 0.017
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Resources

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Thermal Reliability of Laser-ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing

This paper examines the thermal reliability of microvias and standard vias in relation to the materials and processes in which by they are created.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

Thermal Management of PCBs in Embedded Systems

This presentation discusses thermal management considerations for embedded systems.

Understanding Glass Transition Temperature Measurements of Printed Circuit Boards by DSC

This application note discusses how Differential Scanning Calorimetry (DSC) measures the flow of heat into or out of a sample compared to a reference.

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