P96/P26

Polyimide UL V-0 Laminate and Prepreg

Isola offers a product line of polyimide-based prepreg (P26) and core material (P96) for high temperature printed circuit applications.

Thermal Performance

Tg: 260°C
Td: 396°C

Electrical Performance

Dk: 3.76
Df: 0.017

Industry Approvals

IPC-4101 /40 /41
UL - File Number E41625

These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • Good flow and fill
    • Multiple reflow capable

Production & Manufacturing

Currently manufactured in North America

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 260 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 396 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. 50 to 260°C, (Total Expansion)
55
1.5
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
F. @ 10 GHz
3.83
3.80
3.78
3.76
3.73
3.73
2.5.5.9
2.5.5.9
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
F. @ 10 GHz
0.0135
0.0151
0.0172
0.0179
0.0188
0.021
2.5.5.9
2.5.5.9
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
3 x 106
2 x 108
2.5.17.1
Dielectric Breakdown >55 kV 2.5.6B
Arc Resistance 130 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 44 (1100) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 4 (100-174) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
83.6
55.5
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
55.5
35.4
ksi ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3958
3530
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.189
0.154
ASTM D3039
Moisture Absorption 0.5 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 140 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Corrected MOT value to match UL file - 11/18

Core Data

Construction Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 Ghz
1x106 70.0% Alternate 0.0020 0.051 3.70
0.0150
3.60
0.0170
3.60
0.0200
3.60
0.0210
3.60
0.0240
3.60
0.0290
1x106 74.0% Standard 0.0025 0.064 3.60
0.0160
3.60
0.0180
3.50
0.0200
3.50
0.0210
3.50
0.0250
3.50
0.0300
1x1080 61.0% Standard 0.0030 0.076 3.80
0.0140
3.80
0.0160
3.80
0.0180
3.80
0.0190
3.70
0.0220
3.70
0.0260
2x106 66.0% Standard 0.0035 0.089 3.70
0.0150
3.70
0.0160
3.70
0.0190
3.70
0.0200
3.60
0.0230
3.60
0.0280
1x2116 45.0% Standard 0.0040 0.102 4.20
0.0120
4.20
0.0140
4.10
0.0160
4.10
0.0160
4.10
0.0190
4.10
0.0220
106/1080 58.0% Alternate 0.0042 0.107 3.90
0.0130
3.80
0.0150
3.80
0.0170
3.80
0.0180
3.80
0.0210
3.80
0.2490
106/1080 62.0% Standard 0.0045 0.114 3.80
0.0140
3.80
0.0160
3.80
0.0180
3.80
0.0190
3.70
0.0220
3.70
0.0260
106/1080 65.0% Alternate 0.0050 0.127 3.80
0.0140
3.70
0.0160
3.70
0.0190
3.70
0.0200
3.70
0.0230
3.70
0.0270
2x1080 57.0% Standard 0.0050 0.127 3.90
0.0130
3.80
0.0150
3.90
0.0170
3.80
0.0180
3.80
0.0210
3.80
0.2490
106/2113 53.0% Standard 0.0053 0.135 4.00
0.0130
4.00
0.0150
3.90
0.0170
3.90
0.0170
3.90
0.0200
3.90
0.0240
106/2116 49.0% Standard 0.0060 0.152 4.10
0.0130
4.00
0.0140
4.00
0.0160
4.00
0.0160
4.00
0.0190
4.00
0.0220
1080/2116 51.0% Standard 0.0070 0.178 4.00
0.0130
4.00
0.0140
4.00
0.0160
4.00
0.0170
3.90
0.0200
3.90
0.0230
2113/2116 47.0% Standard 0.0080 0.203 4.10
0.0120
4.10
0.0140
4.10
0.0160
4.10
0.0160
4.00
0.0190
4.00
0.0220
2113/2116 48.0% Standard 0.0080 0.203 4.10
0.0120
4.10
0.0140
4.10
0.0160
4.00
0.0160
4.00
0.0190
4.00
0.0220
2x2113/106 54.0% Standard 0.0090 0.229 4.00
0.0130
3.90
0.0150
3.90
0.0170
3.90
0.0170
3.90
0.0200
3.90
0.0240
2x1080/2116 54.0% Standard 0.0100 0.254 4.00
0.0130
3.90
0.0150
3.90
0.0170
3.90
0.0170
3.90
0.0200
3.90
0.0240
7628/2x1080 45.0% Standard 0.0120 0.305 4.20
0.0120
4.20
0.0140
4.10
0.0160
4.10
0.0160
4.10
0.0190
4.10
0.0220
2x7628 39.0% Standard 0.0140 0.356 4.30
0.0110
4.30
0.0120
4.20
0.0140
4.20
0.0140
4.20
0.0170
4.20
0.0190
2x7628/1080 42.0% Alternate 0.0160 0.406 4.00
0.0090
4.00
0.0090
4.00
0.0100
4.00
0.0110
4.00
0.0110
4.00
0.0110
2x7628/2113 41.0% Alternate 0.0180 0.457 4.10
0.0090
4.10
0.0090
4.00
0.0100
4.00
0.0110
4.00
0.0110
4.00
0.0110
3x7628 38.0% Alternate 0.0200 0.508 4.20
0.0110
4.20
0.0120
4.20
0.0140
4.20
0.0140
4.10
0.0170
4.10
0.0190
3x7628/2116 40.0% Alternate 0.0240 0.610 4.30
0.0110
4.20
0.0120
4.20
0.0140
4.20
0.0150
4.20
0.0170
4.20
0.0200
4x7628 39.0% Standard 0.0280 0.711 4.30
0.0110
4.30
0.0120
4.20
0.0140
4.20
0.0140
4.20
0.0170
4.20
0.0190
4x7628/2116 39.0% Standard 0.0310 0.787 4.30
0.0110
4.30
0.0120
4.20
0.0140
4.20
0.0140
4.20
0.0170
4.20
0.0190
6x7628 36.0% Standard 0.0390 0.991 4.30
0.0100
4.30
0.0120
4.30
0.0130
4.30
0.0140
4.30
0.0160
4.30
0.0180
1x2116/ 8x7628 38.0% Standard 0.0590 1.499 4.30
0.0110
4.30
0.0120
4.30
0.0140
4.30
0.0140
4.20
0.0170
4.20
0.0190

Prepreg Data

Glass Style Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 Ghz
106 75.0% 0.0025 0.064 3.59
0.0156
3.55
0.0177
3.53
0.0205
3.50
0.0215
3.48
0.0255
3.48
0.0302
1080 65.0% 0.0032 0.081 3.76
0.0144
3.72
0.0163
3.70
0.0187
3.67
0.0195
3.66
0.0231
3.66
0.0272
2113 57.0% 0.0044 0.112 3.91
0.0135
3.87
0.0152
3.86
0.0173
3.83
0.0180
3.82
0.0211
3.82
0.0247
2116 54.0% 0.0052 0.132 3.97
0.0132
3.93
0.0147
3.92
0.0167
3.89
0.0174
3.88
0.0203
3.88
0.0238
7628 42.0% 0.0074 0.188 4.22
0.0115
4.19
0.0128
4.18
0.0145
4.17
0.0150
4.14
0.0175
4.14
0.0201

NOTE

Revisions:

A-Original-4/17

B-Modified construction offering 6/19

C-Corrected 31 mil core thickness 9/19

D-Corrected 18 mil 1x2113/2x7628 2/21

Standard-Commonly available with the best availability.

Alternate-Available, but not stocked with longer lead time

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Laminates, Prepreg, & PCB Materials
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