IS420

Lead Free Epoxy Laminate and Prepreg

IS420 is a high performance 170°C glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.

Thermal Performance

Tg: 170°C
Td: 350°C

Electrical Performance

Dk: 4.04
Df: 0.021

Industry Approvals

IPC-4101 /98 /99 /101 /126
UL - File Number E41625

IS420 laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability.

In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The IS420 system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimagable solder mask imaging.

Attributes

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Production & Manufacturing

Currently manufactured in Asia, Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 170 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 350 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>15
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
230
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
4.24
4.17
4.04
3.92
3.92
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0150
0.0161
0.0210
0.0250
0.0250
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm 2.5.17.1
Surface Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
3.0 x 106
2.0 x 108
2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 115 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 54 (1350) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
82.7
60.9
ksi 2.4.4B
Moisture Absorption 0.15 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Added /126 slash sheet 02/20

Core Data

Constructions Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 1 GHz 2 GHz 10 GHz
1x106 72% 0.002 0.050 4.30
0.1800
4.10
0.1800
3.95
0.0210
3.90
0.0240
1x1080 64% 0.003 0.075 4.65
0.0180
4.26
0.0180
4.15
0.0210
4.10
0.0230
1x2116 47% 0.004 0.100 4.60
0.0160
4.52
0.0160
4.35
0.0170
4.25
0.0170
1x2116 55% 0.005 0.125 4.75
0.0160
4.37
0.0160
4.25
0.0170
4.20
0.0170
1x1652 52% 0.006 0.150 4.75
0.0170
4.40
0.0170
4.25
0.0180
4.20
0.0190
1x7628 43% 0.007 0.175 4.90
0.0160
4.58
0.0160
4.45
0.0170
4.35
0.0170
1x7628 48% 0.008 0.200 4.85
0.0160
4.50
0.0160
4.40
0.0170
4.35
0.0180
2x2116 55% 0.010 0.250 4.75
0.0160
4.37
0.0160
4.25
0.0170
4.20
0.0170
2x1652 52% 0.012 0.300 4.75
0.0170
4.40
0.0170
4.25
0.0180
4.20
0.0190
2x7628 44% 0.014 0.360 4.90
0.0160
4.57
0.0160
4.45
0.0170
4.40
0.0170
2x7628 48% 0.016 0.410 4.85
0.0160
4.50
0.0160
4.40
0.0170
4.35
0.0180
3x1652 52% 0.018 0.460 4.75
0.0170
4.40
0.0170
4.25
0.0180
4.20
0.0190
3x7628 42% 0.020 0.510 4.91
0.0160
4.60
0.0160
4.45
0.0170
4.35
0.0170
3x7628 44% 0.021 0.540 4.90
0.0160
4.57
0.0160
4.45
0.0170
4.40
0.0170
3x7628 48% 0.024 0.610 4.85
0.0160
4.50
0.0160
4.40
0.0170
4.35
0.0180
4x7628 44% 0.028 0.710 4.90
0.0160
4.57
0.0160
4.45
0.0170
4.40
0.0170
4x7628 46% 0.030 0.760 4.87
0.0160
4.53
0.0160
4.42
0.0170
4.37
0.0180
5x7628 48% 0.039 1.000 4.85
0.0160
4.50
0.0160
4.40
0.0170
4.35
0.0180
6x7628 48% 0.047 1.200 4.85
0.0160
4.50
0.0160
4.40
0.0170
4.35
0.0180
8x7628 45% 0.058 1.460 4.89
0.0160
4.55
0.0160
4.46
0.0170
4.36
0.0170

Prepreg Data

Glass Style Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 1 GHz 2 GHz 10 GHz
106 72% 0.0020 0.051 4.30
0.0180
4.10
0.0190
3.95
0.0200
3.90
0.0240
106 76% 0.0024 0.060 4.28
0.0190
4.02
0.0200
3.87
0.0210
3.82
0.0250
1080 64% 0.0029 0.073 4.50
0.0170
4.30
0.0180
4.05
0.0190
4.00
0.0210
1080 70% 0.0035 0.090 4.38
0.0180
4.14
0.0190
4.00
0.0200
3.94
0.0240
2113 57% 0.0039 0.098 4.64
0.0170
4.40
0.0180
4.26
0.0180
4.20
0.0200
2116 52% 0.0046 0.116 4.74
0.0170
4.50
0.0170
4.36
0.0180
4.30
0.0190
2116 57% 0.0052 0.132 4.64
0.0170
4.40
0.0180
4.26
0.0180
4.20
0.0200
7628 45% 0.0074 0.187 4.85
0.0160
4.64
0.0160
4.50
0.0170
4.34
0.0180
7628 50% 0.0083 0.210 4.75
0.0170
4.54
0.0170
4.40
0.0170
4.24
0.0180

NOTE

Revisions:
A - Original 10/20

Resource Title & Summary Date Updated
IS420 Laminate Safety Data Sheet 07/21/2020
IS420 Prepreg Safety Data Sheet 07/21/2020
IS420 Laminate RoHS Declaration 12/03/2019
IS420 Prepreg RoHS Declaration 12/03/2019
IS420 Processing Guide 06/26/2020

Resources

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials
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