Array ( [new-design] => Array ( [dynval] => [name] => Recommended for New Design [tip] => [secondary] => [value] => 1 ) [halogen-free] => Array ( [dynval] => [name] => Halogen Free [tip] => [secondary] => [value] => 1 ) [glass-transition-temperature-tg-by-dsc] => Array ( [dynval] => dynval_5707ece602022 [name] => Glass Transition Temperature (Tg) by DSC [tip] => [secondary] => Resin Content [value] => 200 ) [dk-permittivity] => Array ( [dynval] => dynval_576242c12fb0e [name] => Dk, Permittivity [tip] => [secondary] => Resin Content [value] => 3.07 ) [decomposition-temperature-td-by-tga-5-weight-loss] => Array ( [dynval] => dynval_5707eda2bb660 [name] => Decomposition Temperature (Td) by TGA @ 5% weight loss [tip] => [secondary] => Resin Content [value] => 400 ) [df-loss-tangent] => Array ( [dynval] => dynval_5762434d99e96 [name] => Df, Loss Tangent [tip] => [secondary] => Resin Content [value] => 0.0018 ) [moisture-absorption] => Array ( [dynval] => dynval_571676e64598b [name] => Moisture Absorption [tip] => [secondary] => Resin Content [value] => — ) [z-axis-cte] => Array ( [dynval] => dynval_577e93eec466a [name] => Z-Axis CTE [tip] => [secondary] => 50 to 260°C, (Total Expansion) [value] => 3.1 ) [peel-strength] => Array ( [dynval] => dynval_571676e64597f [name] => Peel Strength [tip] => [secondary] => Standard profile copper >>> After thermal stress [value] => 0.6 (3.5) ) [tg] => Array ( [value] => 200°C ) [td] => Array ( [value] => 380°C ) )

TerraGreen<sup>®</sup> 400G (RF/MW)

TerraGreen^® 400G (RF/MW)

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G laminate materials are our most advanced ultra high speed, halogen free ultra low loss design solutionnargap.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 200°C Td: 380°C	Dk: 3.07 Df: 0.0018	IPC-4101 /134 UL - File Number E41625

Thermal Performance

Tg: 200°C
Td: 380°C

Electrical Performance

Dk: 3.07
Df: 0.0018

Industry Approvals

IPC-4101 /134

UL - File Number E41625

TerraGreen® 400G (RF/MW) is our Halogen Free material solution for next generation 5G infrastructure and mmWave applications. Our novel resin system has been engineered for high data rates with excellent cost for loss performance.

TerraGreen® 400G (RF/MW) is lead free compatible and can be processed utilizing standard PCB equipment and processing steps.

TerraGreen® 400G (RF/MW) meets UL 94 V-0 and is halogen free.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- CAF resistant
- Lead-free assembly compatible
- 0.8 mm pitch capable
- 6x 260°C reflow capable
- 6x 288°C solder float capable

Processing Advantages
- FR-4 process compatible
- Excellent fill and flow for heavy copper
- Multiple lamination cycles
- HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia

Product Availability

Standard Material Offering: Laminate
- 2.5, 5, 7.5, 10, 12.5, 15, 20, 30, 60 mil ( 0.0635, 0.127, 0.1905, 0.254, 0.3175, 0.381, 0.510, 0.760, 1.50 mm)

Copper Foil Type

Copper Weight
- ½, 1 oz (18 and 35 µm) available
- Heavier copper foil available
- Thinner copper foil available

Standard Material Offering: Prepreg

Glass Fabric Availability
- Low Dk glass
- Square weave glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		200	°C	2.4.25C
Glass Transition Temperature (Tg) by DMA		210	—	2.4.24.4
Glass Transition Temperature (Tg) by TMA		180	°C	2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss		400	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	T288	60+	Minutes	2.4.24.1
Z-Axis CTE		3.1	ppm/°C	2.4.24C
X/Y-Axis CTE		14-23	ppm/°C	2.4.24C
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 5 GHz B. @ 10 GHz C. @ 20 GHz	3.07	—	2.5.5.5
Df, Loss Tangent	A. @ 5 GHz B. @ 10 GHz C. @ 20 GHz	0.0018	—	Bereskin Stripline
Peel Strength	Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]	0.6 (3.5)	N/mm (lb/inch)	2.4.8C
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		130	°C	UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Notes:
All data is preliminary and subject to chaange
* Data was developed using 55% RC rigid laminate

Revisions:
A: Preliminary Release

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Thickness (inch)	Thickness (mm)	2 GHz	5 GHz	10 GHz	15 GHz	20 GHz
Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
0.0025	0.064	3.07 0.0018	3.07 0.0018	3.07 0.0018	3.07 0.0018	3.07 0.0018
0.0050	0.127	3.07 0.0018	3.07 0.0018	3.07 0.0018	3.07 0.0018	3.07 0.0018
0.0100	0.254	3.07 0.0018	3.07 0.0018	3.07 0.0018	3.07 0.0018	3.07 0.0018
0.0200	0.508	3.07 0.0018	3.07 0.0018	3.07 0.0018	3.07 0.0018	3.07 0.0018

NOTE

***ALL DATA IS PRELIMINARY AND SUBJECT TO CHANGE AS ADDITIONAL DATA BECOMES AVAILABLE***

Revisions:
A-Original-4/17
All TerraGreen 400G glass is Spread Weave in both directions

Documentation ▼

Resource Title & Summary	Date Updated
TerraGreen 400G Prepreg RoHS Declaration	03/20/2024
TerraGreen 400G Laminate RoHS Declaration	03/20/2024

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Property		TerraGreen^® 400G (RF/MW)
Recommended for New Design
Halogen Free
Glass Transition Temperature (Tg) by DSC	Resin Content	200
Dk, Permittivity	Resin Content	3.07
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	400
Df, Loss Tangent	Resin Content	0.0018
Moisture Absorption	Resin Content	—
Z-Axis CTE	50 to 260°C, (Total Expansion)	3.1
Peel Strength	Standard profile copper >>> After thermal stress	0.6 (3.5)

TerraGreen® 400G (RF/MW)

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G laminate materials are our most advanced ultra high speed, halogen free ultra low loss design solutionnargap.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Add a Product to Compare to TerraGreen® 400G (RF/MW)

Contact Our Team For Product Information

TerraGreen^® 400G (RF/MW)

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