I-Tera® MT40 (RF/MW)

Very Low-Loss Laminate

I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

Thermal Performance

Tg: 200°C
Td: 360°C

Electrical Performance

Dk: 3.38 / 3.45 / 3.60 / 3.75
Df: 0.0028 - 0.0035

Industry Approvals

IPC-4103 /17
UL - File Number E41625

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between -40°C and +140°C up to W-band frequencies. In addition, I-Tera MT40 offers a very low dissipation factor (Df) of 0.0028 – 0.0035 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.
I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • Dimensional stability
    • Multiple reflow capable
    • Multiple lamination cycles

Production & Manufacturing

Currently manufactured in Europe

Product Availability

  • Standard Material Offering: Laminate
    • 10, 20, 30, 60 mil (0.25, 0.51, 0.76, 1.5 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • HVLP (VLP2) ≤2.5 micron Rz JIS, 1 oz and below is standard
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Glass Transition Temperature (Tg) by TMA 205 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
>60 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
290
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 12 ppm/°C 2.4.24C
Thermal Conductivity 0.61 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 10 GHz
B. @ 10 GHz
C. @ 10 GHz
D. @ 10 GHz
3.38
3.45
3.60
3.75
2.5.5.5
Df, Loss Tangent
A. @ 10 GHz
B. @ 10 GHz
C. @ 10 GHz
D. @ 10 GHz
0.0028
0.0031
0.0035
0.0035
Bereskin Stripline
Volume Resistivity C-96/35/90 1.33 x 107 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33 x 105 2.5.17.1
Dielectric Breakdown 45.4 kV 2.5.6B
Arc Resistance 139 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1133) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength 1 oz. EDC foil
1.0 (5.7)
N/mm (lb/inch) 2.4.8C
Flexural Strength
A. Length direction
B. Cross direction
71.0
58.0
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
39.0
35.0
ksi ASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
0.234
0.222
ASTM D3039
Moisture Absorption 0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Changed VLP2 to HVLP to align with common industry terms 4/21

Core Data

Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 GHz 10 GHz 15 GHz 20 GHz
0.005 0.127 3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
0.010 0.254 3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
0.020 0.508 3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
0.030 0.762 3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
0.040 1.016 3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
0.060 1.524 3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
3.38
0.0028
0.005 0.127 3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
0.0066 0.168 3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
0.010 0.254 3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
0.020 0.508 3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
0.030 0.762 3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
0.060 1.524 3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
3.45
0.0030
0.005 0.127 3.60
0.0032
3.60
0.0032
3.60
0.0032
3.60
0.0032
3.60
0.0032
0.010 0.254 3.60
0.0032
3.60
0.0032
3.60
0.0032
3.60
0.0032
3.60
0.0032
0.020 0.508 3.60
0.0032
3.60
0.0032
3.60
0.0032
3.60
0.0032
3.60
0.0032
0.010 0.254 3.75
0.0033
3.75
0.0033
3.75
0.0033
3.75
0.0033
3.75
0.0033
0.0133 0.338 3.75
0.0033
3.75
0.0033
3.75
0.0033
3.75
0.0033
3.75
0.0033
0.020 0.508 3.75
0.0033
3.75
0.0033
3.75
0.0033
3.75
0.0033
3.75
0.0033
0.030 0.762 3.75
0.0033
3.75
0.0033
3.75
0.0033
3.75
0.0033
3.75
0.0033

NOTE

Revisions:
A-Original Release - 4/17
B-Added 10 mil 3.60 Dk and 30 mil 3.45 Dk - 2/20

Resources

PCB Material Selection for RF, Microwave and Millimeter-wave Design

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost

This presentation discusses the following: - Printed Circuit Board (PCB) - Requirements for Operation in mmWave Frequency Band - Requirements for Automotive Safety Systems - Available Materials - Case Study: Automotive RADAR

PIM in PCBs: Mechanisms & Mitigation

This presentation describes the sources & physical mechanisms of PIM in communication systems.

Passive Intermodulation (PIM) in PCBs

This presentation the sources of Passive Intermodulation in PCBs and how to measure it.

New Thermoset PCB Material Emerging for mmWave Applications

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials
    Isola needs the contact information you provide to us to contact you about our products and services. You may unsubscribe from these communications at any time. For information on how to unsubscribe, as well as our privacy practices and commitment to protecting your privacy, please review our Privacy Policy.