Coefficient Of Thermal Expansion (CTE) Sm

30 December 2015

Related Posts

Blog Post Thumbnail 9.8.25
Advancing Substrate Materials for Next-Generation Electronics: Isola’s Technical Commitment
As system complexity and performance requirements continue to rise, the materials that serve as the foundation for advanced printed circuit boards (PCBs) and packaging substrates play an increasingly critical role. At Isola, we are committed to advancing substrate technology that meets the stringent demands of…
Logo Lg
Isola Group Successfully Transfers Ownership to Investment Group Led by Cerberus Capital Management
CHANDLER, Ariz., January 4, 2018 — Isola Group (“Isola” or the “Company”), a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards, announced today that it has completed an agreement to successfully transfer its equity ownership to…
Del Mar Promo 2022
Isola Shows Circuit Material Solutions for Hybrid Mixed-Signal Circuits at DMEMS2022
Isola Group (www.isola-group.com) brings the latest cost-effective, high-performance PCB material solutions for hybrid circuits to this year’s Del Mar Electronics & Manufacturing Show (DMEMS2022). With growing demand for miniaturization in electronic design, Isola’s materials support compact PCBs for RF/microwave (RF/MW), high-speed-digital (HSD), and power…