Thermal Management Challenges In Embedded Military Electronics Isola

Thermal Management Challenges In Embedded Military Electronics Isola

31 December 2015

Related Posts

These Circuit Materials Are Paving the Way to 6G
5G is Setting Stage for 6G
It seems like only yesterday, but Fifth Generation (5G) cellular networks have been making wireless connections for almost four years. Already, some of the major carriers and test-equipment developers are looking ahead to around 2029 or 2030 and the expected start of Sixth Generation (6G)…
IPCAPEX Social Post
Isola Supports High Speed Digital Circuits at IPC APEX EXPO 2022
Isola Group (www.isola-group.com), a leading global manufacturer of copper-clad laminates and dielectric prepregs for printed circuit boards (PCBs), will be on hand at the IPC APEX EXPO 2022 exhibition with examples of its high-performance circuit materials for high speed digital circuits, including Tachyon® 100G…
ASTRA SOCIAL Astra MT77 product
Astra®MT77 – PTFE Performance without the Hassle!
Isola’s Astra MT77 product enables RF/MW designers to get similar electrical performance traditionally associated with ceramic-filled PTFE systems. The laminate material is a tightly controlled and very low dielectric constant of 3.0, an ultra-low dissipation factor of 0.0017, as well as using the very…