ATIS Logo
03 December 2020
Related Posts
Embedded Computing Blog: Metal Clad Substrates
Isola’s Metal Clad Substrates Featured in Embedded Computing Blog Rich Nass, Brand Director at Embedded Computing discusses Metal Clad Substrates in this new blog post titled, “Thermal Management Techniques Extend Automotive ECU’s Reliability.” In the blog, he features Isola’s Lambda materials. Read…
Isola Grants Patent License to Park Electrochemical Corp.
CHANDLER, ARIZONA, November 24, 2008 – Isola Group S.a.r.l., a leading designer, developer and manufacturer of high performance base materials for the printed circuit board industry, today announced that they have entered into a license agreement with Park Electrochemical Corp. (Park) that grants Park the…
Video: Time to Delamination
Separation of the internal layers of a laminate or printed wiring board is commonly referred to as delamination. Caused by internal stress when the sample is exposed to heat, delamination results in a change in the sample dimension measurable by a Thermomechanical Anaylzer or…