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Isola Completes Testing of Laminate Materials for Conductive Anodic Filament Resistance Data supports the development of CAF-resistant materials for electric vehicle applications CHANDLER, Ariz., November 11, 2014 — Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate…

CHANDLER, ARIZONA, June 29, 2009 – Isola Group S.a.r.l.,  a leading designer, developer and manufacturer of high-performance base materials for the printed circuit board industry, today announced that the shareholders of Isola Group’s Italian laminate company, MAS Italia, authorized the liquidation of that company through…

Metal Clad Substrates Metal Clad Substrates (MCS) are thermally conductive base materials for temperature-sensitive applications. The combination of a copper-clad dielectric and an aluminum carrier delivers effective heat dissipation and provide a great alternative to active cooling methods and thick film techniques. In addition to…