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Exhibit will demonstrate the reliability of ultra-low loss laminates to meet the ever-increasing challenge of faster data rates. CHANDLER, Ariz., January 9, 2013 — Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming DesignCon 2013…

Registration Opens for Inaugural Boards, Chips and Packaging IMPACT Conference Hosted by Isola and Semico Research Airline Captain Chesley B. “Sully” Sullenberger, III to deliver a keynote address during this one-day event that is focused on system-level integration across the entire hardware development process.

Isola’s free Impedance and Power-handling Calculator predicts the design attributes for microstrips and striplines based on the target impedance and dielectric properties of the company’s RF/microwave and millimeter wave laminate materials. Download the software from isoDesign at https://isodesign.isola-group.com/phi-calculator/ (Log in required).