Exhibit will demonstrate the reliability of ultra-low loss laminates to meet the ever-increasing challenge of faster data rates. CHANDLER, Ariz., January 9, 2013 — Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming DesignCon 2013…
Boards, Chips and Packaging IMPACT Conference – October 13, 2015
Registration Opens for Inaugural Boards, Chips and Packaging IMPACT Conference Hosted by Isola and Semico Research Airline Captain Chesley B. “Sully” Sullenberger, III to deliver a keynote address during this one-day event that is focused on system-level integration across the entire hardware development process.
Video: Impedance and Power-handling Calculator Tutorial
Isola’s free Impedance and Power-handling Calculator predicts the design attributes for microstrips and striplines based on the target impedance and dielectric properties of the company’s RF/microwave and millimeter wave laminate materials. Download the software from isoDesign at https://isodesign.isola-group.com/phi-calculator/ (Log in required).