High Density Interconnect

As system complexity and performance requirements continue to rise, the materials that serve as the foundation for advanced printed circuit boards (PCBs) and packaging substrates play an increasingly critical role. At Isola, we are committed to advancing substrate technology that meets the stringent demands of…

The Lean event was represented by participants and experts from the automotive, electronics, medical and other manufacturing industries throughout China. The journey to the prestigious December event was not easy, but the Isola Huizhou team found the way by winning the top prize from the…

When multiple resins systems are used, a hybrid notification will appear. Checking the shield or mask check box will add surface finish and soldermask to the outer layers. Units in mils, mm and µm can be selected. The Zoom function will compress the stack up…