High Density Interconnect

High Density Interconnect

18 March 2021

Related Posts

Logo Lg
Isola Group Successfully Transfers Ownership to Investment Group Led by Cerberus Capital Management
CHANDLER, Ariz., January 4, 2018 — Isola Group (“Isola” or the “Company”), a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards, announced today that it has completed an agreement to successfully transfer its equity ownership to…
Pcb007
Isola Chief Sales and Marketing Officer Sean Mirshafiei – Adapting Processes to Meet New Customer Needs
Isola Chief Sales and Marketing Officer Sean Mirshafiei discusses material market trends and how Isola is adapting product development to meet new customer needs. Sean provides key insights into how Isola identifies technology trends, assesses technology shifts and evaluates underlying technical challenges in order to…
Blog Post Thumbnail 9.8.25
Advancing Substrate Materials for Next-Generation Electronics: Isola’s Technical Commitment
As system complexity and performance requirements continue to rise, the materials that serve as the foundation for advanced printed circuit boards (PCBs) and packaging substrates play an increasingly critical role. At Isola, we are committed to advancing substrate technology that meets the stringent demands of…