No / Low Flow Prepreg

For bonding and adhesion applications, Isola offers materials that provide minimum resin flow and consistent lamination characteristics. Uneven surfaces are completely enclosed and embedded maintaining consistent layer-­to-­layer spacing.

Isola No Flow and Low­Flo® materials demonstrate excellent bonding on various surfaces and can be processed with flex films, such as Mylar®, Kapton®, etc., plain/abrasive copper surfaces, plated metals (tin, solder, nickel etc.), as well as conventional laminate surfaces. We offer three different resin systems in its No Flow and Low­Flo® family to support your application.
A11 and FR406N are epoxy resin systems. A11, with its Tg of 100°C, is suitable for standard applications. FR406N has a Tg of 170°C and was specially designed for high temperature applications. Both epoxy resin systems used standard processing methods.
P25N is a polyimide for high temperature applications such as military, commercial or industrial electronics. It offers a high Tg of 250°C and extended time to delamination (T260: 60 min/ T288: 60 min). This resin system reduces brittleness and offers a greater interlaminate adhesion (peel strength) compared to other polyimide materials.

Features

Overview

  • Products are available in 106 & 1080 in multiple flow ranges
  • Easy processing
  • Compatible for bonding with a variety of surfaces

Typical Applications

  • Heat­sink bonding
  • Cavity boards (direct chip attachment)
  • Mulitlayer rigid flex applications in complex three-dimensional installation locations
  • Laminated insulators
  • Other applications requiring minimal or uniform resin flow

Markets

Related Materials From Isola

A11
Tg: 100°C
Td: 300°C
Dk: 4.50
Df: 0.033
View Details
FR406N
Tg: 170°C
Td: 300°C
Dk: 4.3
Df: 0.025
Markets
View Details
P25N
Tg: 250°C
Td: 383°C
Dk: 3.67
Df: 0.0187
Markets
View Details

Resources

Prepreg Selection: Individual Dielectric Space

This application note discusses how a PCB fabricator use a slightly different method of selecting prepreg to achieve specific thickness and fill requirements.

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Laminates, Prepreg, & PCB Materials
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