No / Low Flow Prepreg

Low Flow Rigid

For bonding and adhesion applications, Isola offers materials that provide minimum resin flow and consistent lamination characteristics. Uneven surfaces are completely enclosed and embedded maintaining consistent layer-­to-­layer spacing.

Our No Flow and Low­Flo® materials demonstrate excellent bonding on various surfaces and can be processed with flex films, such as Mylar®, Kapton®, etc., plain/abrasive copper surfaces, plated metals (tin, solder, nickel etc.), as well as conventional laminate surfaces.

Isola offers three different resin systems in its No Flow and Low­Flo® family to support your application.

A11 and FR406N are epoxy resin systems. A11, with its Tg of 100°C, is suitable for standard applications. FR406N has a Tg of 170°C and was specially designed for high temperature applications. Both epoxy resin systems used standard processing methods.

P25N is a polyimide for high temperature applications such as military, commercial or industrial electronics. It offers a high Tg of 250°C and extended time to delamination (T260: 60 min/ T288: 60 min). This resin system reduces brittleness and offers a greater interlaminate adhesion (peel strength) compared to other polyimide materials.


  • Products are available in 106 & 1080 in multiple flow ranges
  • Easy processing
  • Compatible for bonding with a variety of surfaces
Typical Applications:

  • Heat­sink bonding
  • Cavity boards (direct chip attachment)
  • Mulitlayer rigid flex applications in complex three-dimensional installation locations
  • Laminated insulators
  • Other applications requiring minimal or uniform resin flow
ProductCTE Z-axisTg
by TMA

Webinars, Videos & Articles

Prepreg Selection: Individual Dielectric Space (Application Note)

This application note discusses how a PCB fabricator use a slightly different method of selecting prepreg to achieve specific thickness and fill requirements.