No / Low Flow Prepreg
For bonding and adhesion applications, Isola offers materials that provide minimum resin flow and consistent lamination characteristics. Uneven surfaces are completely enclosed and embedded maintaining consistent layer-to-layer spacing.
Our No Flow and LowFlo® materials demonstrate excellent bonding on various surfaces and can be processed with flex films, such as Mylar®, Kapton®, etc., plain/abrasive copper surfaces, plated metals (tin, solder, nickel etc.), as well as conventional laminate surfaces.
Isola offers three different resin systems in its No Flow and LowFlo® family to support your application.
A11 and FR406N are epoxy resin systems. A11, with its Tg of 100°C, is suitable for standard applications. FR406N has a Tg of 170°C and was specially designed for high temperature applications. Both epoxy resin systems used standard processing methods.
P25N is a polyimide for high temperature applications such as military, commercial or industrial electronics. It offers a high Tg of 250°C and extended time to delamination (T260: 60 min/ T288: 60 min). This resin system reduces brittleness and offers a greater interlaminate adhesion (peel strength) compared to other polyimide materials.
- Products are available in 106 & 1080 in multiple flow ranges
- Easy processing
- Compatible for bonding with a variety of surfaces
- Heatsink bonding
- Cavity boards (direct chip attachment)
- Mulitlayer rigid flex applications in complex three-dimensional installation locations
- Laminated insulators
- Other applications requiring minimal or uniform resin flow
Webinars, Videos & Articles
This application note discusses how a PCB fabricator use a slightly different method of selecting prepreg to achieve specific thickness and fill requirements.