FR402
Tetrafunctional Epoxy Laminate and Prepreg
Thermal Performance | Electrical Performance | Industry Approvals | ||
---|---|---|---|---|
Tg 140°C |
Td 320°C |
Dk 4.25 |
Df 0.015 | IPC-4101 /21 UL - File Number E41625 |
FR402 consists of a modified tetrafunctional epoxy resin system engineered for multilayer applications that require performance characteristics exceeding those of difunctional epoxies.
The formulation of FR402 is designed to enhance throughput and accuracy of laser based Automated Optical Inspection (AOI) equipment. FR402 offers superior resistance to chemical and thermal degradation.
Product Attributes
Typical Market Applications
- There are no typical market applications.
Product Features
-
Industry Recognition
- UL File Number: E41625
- RoHS Compliant
-
Processing Advantages
- FR-4 process compatible
- UV blocking and AOI fluorescence
Product Availability
-
Standard Material Offering: Laminate
- 2 to 125 mil (0.05 to 3.2 mm)
- Available in full size sheet or panel form
-
Copper Foil Type
- HTE Grade 3
- RTF (Reverse Treat Foil)
-
Copper Weight
- ½ to 2 oz (18 to 70 µm) available
- Heavier copper available
- Thinner copper foil available
-
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
-
Glass Fabric Availability
- E-glass
- Square weave glass
Production & Manufacturing
- Currently manufactured in Asia, North America
Property | Typical Value | Units | Test Method | |
---|---|---|---|---|
Metric (English) | IPC-TM-650 (or as noted) | |||
Glass Transition Temperature (Tg) by DSC | 140 | °C | 2.4.25C | |
Decomposition Temperature (Td) by TGA @ 5% weight loss | 315 | °C | 2.4.24.6 | |
Time to Delaminate by TMA (Copper removed) | A. T260 B. T288 | 30 >5 | Minutes | 2.4.24.1 |
Z-Axis CTE | A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion) | 50 250 4.2 | ppm/°C ppm/°C % | 2.4.24C |
X/Y-Axis CTE | Pre-Tg | 15 | ppm/°C | 2.4.24C |
Thermal Conductivity | .36 | W/mK | ASTM E1952 | |
Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched B. Etched | Pass | Pass Visual | 2.4.13.1 |
Dk, Permittivity | A. @ 100 MHz B. @ 500 MHz C. @ 1 GHz | 4.60 4.27 4.25 | — | 2.5.5.3 2.5.5.9 2.5.5.5 |
Df, Loss Tangent | A. @ 100 MHz B. @ 500 MHz | 0.016 0.015 | — | 2.5.5.3 2.5.5.9 |
Dk, Permittivity | @ 1 GHz | 0.015 | — | 2.5.5.5 |
Volume Resistivity | A. C-96/35/90 B. After moisture resistance C. At elevated temperature | 4.0 x 108 — 7.0 x 107 | MΩ-cm | 2.5.17.1 |
Surface Resistivity | A. C-96/35/90 B. After moisture resistance C. At elevated temperature | 3.0 x 106 — 6.0 x 106 | MΩ | 2.5.17.1 |
Dielectric Breakdown | >50 | kV | 2.5.6B | |
Arc Resistance | 120 | Seconds | 2.5.1B | |
Electric Strength (Laminate & laminated prepreg) | 29 (1100) | kV/mm (V/mil) | 2.5.6.2A | |
Comparative Tracking Index (CTI) | 3 (175-249) | Class (Volts) | UL 746A ASTM D3638 | |
Peel Strength | A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions | 1.05 (8.0) 1.45 (9.0) 1.25 (8.0) 1.45 (9.0) | N/mm (lb/inch) | 2.4.8C 2.4.8.2A 2.4.8.3 2.4.8.3 |
Flexural Strength | A. Length direction B. Cross direction | 92.0 62.3 | ksi | 2.4.4B |
Tensile Strength | A. Length direction B. Cross direction | 60.0 43.2 | ksi | ASTM D3039 |
Young's Modulus | A. Length direction B. Cross direction | 3500 3000 | ksi | ASTM D790-15e2 |
Moisture Absorption | 0.3 | % | 2.6.2.1A | |
Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
Max Operating Temperature | 130 | °C | UL 796 | |
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold. |
Visit our site https://www.isola-group.com for more details.
Revision B: Corrected units for Flexural and Tensile Strength
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This presentation describes the process of laminate and prepreg manufacturing.
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