FR406

High Performance Epoxy Laminate and Prepreg

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
170°C		 Td
300°C		 Dk
3.93		 Df
0.0167
IPC-4101 /21 /24 /26
UL - File Number E41625
FR406 sets the industry standard for high performance epoxy materials.

This product is engineered to meet the demands of the multilayer printed circuit board industry, while maintaining standard FR-4 processing. FR406 offers improved dimensional control, superior chemical and thermal performance and product consistency.

Product Attributes

Typical Market Applications

  • There are no typical market applications.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence
    • No post bake after pressing

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

  • Currently manufactured in Asia, North America
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC170°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss300°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
10
>2
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
60
250
3.5
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg13ppm/°C2.4.24C
Thermal Conductivity0.3-0.4W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
4.00
3.95
3.93
3.92
3.92
—
2.5.5.3
2.5.5.9
2.5.5.5
2.5.5.5
2.5.5.5
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0130
0.0161
0.0167
0.0172
0.0172
—
2.5.5.3
2.5.5.9
2.5.5.5
2.5.5.5
2.5.5.5
Volume Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
9.0 x 107
—
3.0 x 107
MΩ-cm2.5.17.1
Surface Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
3.0 x 108
—
8.0 x 108
MΩ2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance90Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)44 (1100)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.19 (7.0)

1.60 (9.0)
1.19 (7.0)
1.60 (9.0)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
93.7
78.2
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
63.0
47.7
ksiASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3684
3116
ksiASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.191
0.154
—ASTM D3039
Moisture Absorption0.2%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
NOTE

Visit our site https://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19

Core Data

ConstructionResin Content %Standard/AlternateThinckness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
1x108058.0%Standard0.00250.064
3.83
0.014
3.79
0.016
3.77
0.018
3.75
0.019
3.72
0.019
3.72
0.019
1x211344.0%Standard0.00300.076
4.14
0.012
4.10
0.014
4.09
0.015
4.07
0.016
4.06
0.016
4.06
0.016
2x10665.0%Standard0.00350.089
3.69
0.015
3.65
0.017
3.63
0.019
3.61
0.020
3.58
0.020
3.58
0.020
1x211645.0%Standard0.00400.102
4.11
0.012
4.08
0.014
4.07
0.015
4.04
0.016
4.02
0.016
4.02
0.016
1x307048.0%Alternate0.00400.102
4.04
0.013
4.01
0.014
3.99
0.016
3.97
0.017
3.95
0.017
3.95
0.017
106/108060.0%Standard0.00430.109
3.79
0.014
3.75
0.016
3.73
0.018
3.71
0.019
3.68
0.020
3.68
0.020
1x165242.0%Standard0.00500.127
4.18
0.012
4.15
0.013
4.14
0.015
4.12
0.015
4.10
0.016
4.10
0.016
106/211356.0%Standard0.00530.135
3.87
0.014
3.83
0.015
3.82
0.017
3.79
0.018
3.76
0.019
3.76
0.019
1080/211353.0%Standard0.00600.152
3.93
0.013
3.90
0.015
3.88
0.017
3.86
0.018
3.83
0.018
3.83
0.018
1x762841.0%Standard0.00700.178
4.21
0.012
4.18
0.013
4.17
0.015
4.14
0.015
4.12
0.015
4.12
0.015
2113/211644.0%Alternate0.00700.178
4.14
0.012
4.10
0.014
4.09
0.015
4.07
0.016
4.06
0.016
4.06
0.016
2x211645.0%Standard0.00800.203
4.11
0.012
4.08
0.014
4.07
0.015
4.04
0.016
4.02
0.016
4.02
0.016
2x211652.0%Standard0.00950.241
3.95
0.013
3.92
0.015
3.90
0.017
3.88
0.017
3.85
0.018
3.85
0.018
2x165242.0%Standard0.01000.254
4.18
0.012
4.15
0.013
4.14
0.015
4.12
0.015
4.10
0.016
4.10
0.016
2x1080/762847.0%Standard0.01200.305
4.06
0.013
4.03
0.014
4.02
0.016
3.99
0.016
3.97
0.017
3.97
0.017
2x762841.0%Standard0.01400.356
4.21
0.012
4.18
0.013
4.17
0.015
4.14
0.015
4.12
0.015
4.12
0.015
2x7628/211642.0%Standard0.01800.457
4.18
0.012
4.15
0.013
4.14
0.015
4.12
0.015
4.10
0.016
4.10
0.016
3x762840.0%Standard0.02100.533
4.23
0.012
4.20
0.013
4.19
0.014
4.17
0.015
4.15
0.015
4.15
0.015
3x7628/108042.0%Standard0.02400.610
4.18
0.012
4.15
0.013
4.14
0.015
4.12
0.015
4.10
0.016
4.10
0.016
4x762840.0%Standard0.02800.711
4.23
0.012
4.20
0.013
4.19
0.014
4.17
0.015
4.15
0.015
4.15
0.015
4x7628/108042.0%Standard0.03100.787
4.18
0.012
4.15
0.013
4.14
0.015
4.12
0.015
4.10
0.016
4.10
0.016
5x762840.0%Standard0.03500.889
4.23
0.012
4.20
0.013
4.19
0.014
4.17
0.015
4.15
0.015
4.15
0.015

Prepreg Data

Glass StyleResin Content %Standard/AlternateThickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
10675.0%Standard0.00250.064
3.52
0.016
3.47
0.018
3.45
0.021
3.42
0.022
3.39
0.023
3.39
0.023
108065.0%Standard0.00330.084
3.69
0.015
3.65
0.017
3.63
0.019
3.61
0.020
3.58
0.021
3.58
0.021
211357.0%Standard0.00420.107
3.85
0.014
3.81
0.016
3.79
0.018
3.77
0.018
3.74
0.019
3.74
0.019
211656.0%Standard0.00540.137
3.87
0.014
3.83
0.015
3.82
0.017
3.79
0.018
3.76
0.019
3.76
0.019
165250.0%Standard0.00590.150
4.00
0.013
3.96
0.014
3.95
0.016
3.92
0.017
3.90
0.017
3.90
0.017
211662.0%Alternate0.00640.163
3.75
0.014
3.71
0.016
3.69
0.019
3.67
0.019
3.64
0.020
3.64
0.020
762842.0%Standard0.00750.191
4.18
0.012
4.15
0.013
4.14
0.015
4.12
0.015
4.10
0.016
4.10
0.016
762847.0%Alternate0.00840.213
4.06
0.013
4.03
0.014
4.02
0.016
3.99
0.016
3.97
0.017
3.97
0.017
762850.0%Alternate0.00910.231
4.00
0.013
3.96
0.014
3.95
0.016
3.92
0.017
3.90
0.017
3.90
0.017
NOTE
Revisions:
A-Original-4/17
B-Added Standard/Alternate construction notation 8/18
Standard-Commonly available with the best availability.
Alternate-Available, but not stocked with longer lead time
FR406 Prepreg Safety Data Sheet
10/09/2019
FR406 Laminate Safety Data Sheet
10/09/2019
FR406 Laminate Supplemental Report
03/22/2019
FR406 Prepreg Supplemental Report
03/22/2019
FR406 Laminate RoHS Declaration
03/22/2019
FR406 Prepreg RoHS Declaration
03/22/2019
FR406 Processing Guide
10/14/2019

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Laminate & Prepreg Manufacturing (Presentation)

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