IS550H

Halogen-free, Very Low Loss Material

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
200°C
Td
400°C
Dk
4.43
Df
0.016
IPC-4101 /140
UL - File Number E41625
IS550H is our Halogen Free laminate solution for high power & voltage applications that require extreme thermal stability.

IS550H was developed in conjunction with a consortium of industry experts for high power & high voltage applications and PEV & HEV automotive electrification.  The resulting solution addresses critical application needs for use in a harsh environment where very demanding, long term thermal reliability performance, extreme thermal cycling and very high voltage CAF & electro-migration resistance is required.

Typical Market Applications

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 60 mil (0.05 to 1.5 mm)
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Mechanically spread glass

Production & Manufacturing

  • Currently manufactured in Asia, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC200°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss400°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
38
210
2.2
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg13-17ppm/°C2.4.24C
Thermal Conductivity0.7W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
4.50
4.43
4.43
2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
0.014
0.014
0.016
Bereskin Stripline
Volume Resistivity
A. C-96/35/90
B. At elevated temperature
5.2 x 107
3.2 x 108
MΩ-cm2.5.17.1
Surface Resistivity
A. C-96/35/90
B. At elevated temperature
1.0 x 108
3.9 x 108
2.5.17.1
Dielectric Breakdown60.0kV2.5.6B
Arc ResistanceTBDSeconds2.5.1B
Electric Strength (Laminate & laminated prepreg)46.9(1190)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
1.45 (8.2)
1.35(7.6)
N/mm (lb/inch)2.4.8C
Flexural Strength
A. Length direction
B. Cross direction
60.9
50.8
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
TBDksiASTM D3039
Moisture Absorption0.25%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)150°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
NOTE

Visit our site https://www.isola-group.com for more details.
Revisions:
A: Initial release - 9/19

NOTE
Revisions:
A-Original-9/19
Standard-Commonly available with the best availability.
Alternate-Available, but not stocked with longer lead time
09/19/2019
09/19/2019
09/18/2019

Webinars, Videos & Articles

High Tg Bromine-free Laminates for PWB Applications (Technical Paper)

This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

Halogen Free Base Materials for PWB Applications (Technical Paper)

This paper discusses the challenges and concerns of commercially-available non-halogen materials.

Meeting Flame Resistance Requirements for Green Electronics (Presentation)

This presentation discusses challenges and opportunities for halogen-free laminates.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications (Presentation)

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

If you have any questions about IS550H, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in IS550H

  • This field is for validation purposes and should be left unchanged.