COATED COPPER FOILS FOR HIGH DENSITY ICs

It seems like only yesterday, but Fifth Generation (5G) cellular networks have been making wireless connections for almost four years. Already, some of the major carriers and test-equipment developers are looking ahead to around 2029 or 2030 and the expected start of Sixth Generation (6G)…

CHANDLER, Ariz., August 15, 2016 — Isola, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced that it has appointed Ken Rizvi as Chief Financial Officer, effective immediately. Rizvi succeeds Interim CFO Donald Colvin,…

Isola partnered with I-Connect007 in 2026 to create a six-part podcast series titled PCB Materials: The Backbone and Future of Electronics. The series features Isola President Sean Mirshafiei and Marcy LaRont of I-Connect007 and focuses on the critical role PCB base materials play in product…