Passive Intermodulation (PIM) In PCBs

Passive Intermodulation (PIM) In PCBs

06 August 2016

Related Posts

These Circuit Materials Are Paving the Way to 6G
5G is Setting Stage for 6G
It seems like only yesterday, but Fifth Generation (5G) cellular networks have been making wireless connections for almost four years. Already, some of the major carriers and test-equipment developers are looking ahead to around 2029 or 2030 and the expected start of Sixth Generation (6G)…
TPCA POST 2022
Isola Reaches Higher in Frequency at 2022 TPCA Show in Taipei
Isola Asia Pacific will be well represented by its circuit material experts at the 2022 Taiwan PCB & Assembly (TPCA) Show (www.tpcashow.com), as they advise attendees on the optimum uses of their materials for the growing numbers of high-frequency analog and high-speed-digital (HSD) electronic…
Materials Meet Needs Of Millimeter Wave AIppich
Materials Meet Needs of Millimeter-Wave 5G Small Cells
  Fifth Generation (5G) networks offer extensive wireless services with even faster data rates to come. Most of the systems have been based on signals below 6 GHz. Once network coverage has been achieved at higher, millimeter-wave (mmWave) frequencies of 24 GHz and higher,…