Predicting Dimensional Deformation During Lamination For Multilayer Printed Circuit Boards

Predicting Dimensional Deformation During Lamination For Multilayer Printed Circuit Boards

08 August 2016

Related Posts

Pcb007
Isola Chief Sales and Marketing Officer Sean Mirshafiei – Adapting Processes to Meet New Customer Needs
Isola Chief Sales and Marketing Officer Sean Mirshafiei discusses material market trends and how Isola is adapting product development to meet new customer needs. Sean provides key insights into how Isola identifies technology trends, assesses technology shifts and evaluates underlying technical challenges in order to…
Tct Emx Isola Logo
Distributor Announcement
IMS Promo 2 2022
PCB Materials Pave the Way to Faster, Higher-Frequency Circuits
  Designers looking to trim losses, size, and weight from high-speed, high-frequency printed-circuit boards (PCBs) will want to visit Isola Group in Booth #5090 at IMS2022. There, the company will display an array of its advanced circuit materials, which are formulated for low…