Predicting Dimensional Deformation During Lamination For Multilayer Printed Circuit Boards

Predicting Dimensional Deformation During Lamination For Multilayer Printed Circuit Boards

08 August 2016

Related Posts

TPCA POST 2022
Isola Reaches Higher in Frequency at 2022 TPCA Show in Taipei
Isola Asia Pacific will be well represented by its circuit material experts at the 2022 Taiwan PCB & Assembly (TPCA) Show (www.tpcashow.com), as they advise attendees on the optimum uses of their materials for the growing numbers of high-frequency analog and high-speed-digital (HSD) electronic…
DMEMS2023
Isola Shows Circuit Material Solutions for Hybrid Mixed-Signal Circuits at DMEMS2023
Isola Group brings the latest cost-effective, high-performance PCB material solutions for hybrid circuits to this year’s Del Mar Electronics & Manufacturing Show (DMEMS2023). With growing demand for miniaturization in electronic design, Isola’s materials support compact PCBs for RF/microwave (RF/MW), high-speed-digital (HSD), and power circuits…
Isostack Tool Help – Left Panel
Click on core or prepreg tab to display the materials for your design. You can right click and drag and drop a core or prepreg item into the stack up editor. Any unused core or prepreg item can be removed from the list by clicking…