Thermal Reliability Of Laser Ablated Microvias And Standard Through Hole Technologies As A Function Of Materials And Processing

Thermal Reliability Of Laser Ablated Microvias And Standard Through Hole Technologies As A Function Of Materials And Processing

09 August 2016

Related Posts

Isostack Tool Help – Central Panel
When multiple resins systems are used, a hybrid notification will appear. Checking the shield or mask check box will add surface finish and soldermask to the outer layers. Units in mils, mm and µm can be selected. The Zoom function will compress the stack up…
Do Materials Matter James Francey
How Do Material Qualities Differ for HSD Versus mmWave Circuits?
Growing use of millimeter-wave (mmWave) frequencies for applications such as automotive radars, Fifth Generation (5G) wireless networks, and satellite communications (satcom) mandates careful selection of printed-circuit-board (PCB) materials specially formulated to transmit signals at frequencies to 70 GHz and higher. At the same time, digital…
Mg Pcb007 Interview Isola Release of IS550H
Isola Releases IS550H Material: Interview with Experts
Interview by Nolan Johnson Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.   Nolan Johnson:…